TY - GEN

T1 - Powerline Communication System-on-Chip in 180 nm Harsh Environment SOI Technology

AU - Stuckenberg, Tobias

AU - Rücker, Malte

AU - Rother, Niklas

AU - Nowosielski, Rochus

AU - Wiese, Frank

AU - Blume, Holger

N1 - Publisher Copyright: © 2021 IEEE.

PY - 2021

Y1 - 2021

N2 - Broadband powerline communication systems using Orthogonal Frequency Division Multiplexing (OFDM) can utilize existing power lines to transmit data packets alongside power distribution. Recent standards focus towards high speed multi-media in-house streaming. With improvements towards robustness and throughput new standards increase the speed and reliability of in-house powerline systems. A very different approach is the use of powerline communication systems in a deep drilling environment where temperatures of more than 150°C and pressure levels up to 30 000 psi are present. Typical applications in this environment usually do not require more than several kbit/ys per node and are more reliant on a stable and continuous connection. Here, a powerline communication system can reduce the amount of wiring needed and increase communication robustness significantly. This work provides a harsh environment suitable, reliable and standard compliant communication ASIC that is manufactured in XFAB 180 nm Silicon-On-Insulator (SOI) technology allowing operating temperatures of up to 175°C. The die size is 5.25 mm x 5.25 mm and contains a complete Homeplug 1.0 communication stack with an environment for boot, interfacing and debugging. The data rate is as high as 6.1 Mbit/s using the fastest transmission mode and reaches the theoretical maximum of 0.55 Mbit/s in the robust OFDM (ROBO) mode which is of particular interest for harsh environment applications. To the best of the authors knowledge, this is the first OFDM-based powerline communication ASIC which is particularly designed for harsh environment.

AB - Broadband powerline communication systems using Orthogonal Frequency Division Multiplexing (OFDM) can utilize existing power lines to transmit data packets alongside power distribution. Recent standards focus towards high speed multi-media in-house streaming. With improvements towards robustness and throughput new standards increase the speed and reliability of in-house powerline systems. A very different approach is the use of powerline communication systems in a deep drilling environment where temperatures of more than 150°C and pressure levels up to 30 000 psi are present. Typical applications in this environment usually do not require more than several kbit/ys per node and are more reliant on a stable and continuous connection. Here, a powerline communication system can reduce the amount of wiring needed and increase communication robustness significantly. This work provides a harsh environment suitable, reliable and standard compliant communication ASIC that is manufactured in XFAB 180 nm Silicon-On-Insulator (SOI) technology allowing operating temperatures of up to 175°C. The die size is 5.25 mm x 5.25 mm and contains a complete Homeplug 1.0 communication stack with an environment for boot, interfacing and debugging. The data rate is as high as 6.1 Mbit/s using the fastest transmission mode and reaches the theoretical maximum of 0.55 Mbit/s in the robust OFDM (ROBO) mode which is of particular interest for harsh environment applications. To the best of the authors knowledge, this is the first OFDM-based powerline communication ASIC which is particularly designed for harsh environment.

KW - Homeplug

KW - Powerline

KW - SoC

KW - SOI

KW - XFAB XT018

KW - Harsh Environment

UR - http://www.scopus.com/inward/record.url?scp=85123500385&partnerID=8YFLogxK

U2 - 10.15488/13273

DO - 10.15488/13273

M3 - Conference contribution

SN - 978-1-6654-0713-7

BT - Proceedings of the 2021 IEEE Nordic Circuits and Systems Conference (NORCAS)

A2 - Nurmi, Jari

A2 - Wisland, Dag T.

A2 - Aunet, Snorre

A2 - Kjelgaard, Kristian

ER -