Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems, Proceedings |
| Herausgeber (Verlag) | VDE Verlag GmbH |
| ISBN (elektronisch) | 9783800735785 |
| Publikationsstatus | Veröffentlicht - 2014 |
| Veranstaltung | 8th International Conference on Integrated Power Electronics Systems, CIPS 2014 - Nuremberg, Deutschland Dauer: 25 Feb. 2014 → 27 Feb. 2014 |
Publikationsreihe
| Name | CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems, Proceedings |
|---|
Abstract
This paper shows how developers are spoilt for choice while choosing a packaging concept for a new power electronic system or sub-system and also addresses the needs and requirements of future packaging solutions. For example some new Asian PV Inverters come up with semiconductor packaging solutions which have gone out of style regarding to European semiconductor and packaging companies. And even in Europe PV Inverters up to a power rating of 27kW are manufactured using discrete power components. This paper starts with an overview about the requirements of semiconductor packages and arrangements for power electronic converters in the range from several kW up to approx. 30kW. The impacts of the power semiconductor package solutions on other parameters, especially the PCB design and principal cooling solutions are shown and discussed based on examples. An analysis of three different packaging solutions is presented. The promises and limits of new semiconductor materials like SiC in according to converters are demon-strated and discussed considering the special requirements for packaging solutions enabling the application with a high performance.
ASJC Scopus Sachgebiete
- Energie (insg.)
- Energieanlagenbau und Kraftwerkstechnik
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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- BibTex
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CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems, Proceedings. VDE Verlag GmbH, 2014. (CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems, Proceedings).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Power semiconductor packaging in PV inverters up to 30 kW power, a difficult choice
AU - Hinze, Juliane
AU - Zacharias, Peter
AU - Araujo, Samuel
AU - Friebe, Jens
AU - Leifert, Torsten
N1 - Publisher Copyright: © VDE Verlag GMBH ∙ Berlin ∙ Offenbach, Germany Copyright: Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2014
Y1 - 2014
N2 - This paper shows how developers are spoilt for choice while choosing a packaging concept for a new power electronic system or sub-system and also addresses the needs and requirements of future packaging solutions. For example some new Asian PV Inverters come up with semiconductor packaging solutions which have gone out of style regarding to European semiconductor and packaging companies. And even in Europe PV Inverters up to a power rating of 27kW are manufactured using discrete power components. This paper starts with an overview about the requirements of semiconductor packages and arrangements for power electronic converters in the range from several kW up to approx. 30kW. The impacts of the power semiconductor package solutions on other parameters, especially the PCB design and principal cooling solutions are shown and discussed based on examples. An analysis of three different packaging solutions is presented. The promises and limits of new semiconductor materials like SiC in according to converters are demon-strated and discussed considering the special requirements for packaging solutions enabling the application with a high performance.
AB - This paper shows how developers are spoilt for choice while choosing a packaging concept for a new power electronic system or sub-system and also addresses the needs and requirements of future packaging solutions. For example some new Asian PV Inverters come up with semiconductor packaging solutions which have gone out of style regarding to European semiconductor and packaging companies. And even in Europe PV Inverters up to a power rating of 27kW are manufactured using discrete power components. This paper starts with an overview about the requirements of semiconductor packages and arrangements for power electronic converters in the range from several kW up to approx. 30kW. The impacts of the power semiconductor package solutions on other parameters, especially the PCB design and principal cooling solutions are shown and discussed based on examples. An analysis of three different packaging solutions is presented. The promises and limits of new semiconductor materials like SiC in according to converters are demon-strated and discussed considering the special requirements for packaging solutions enabling the application with a high performance.
UR - http://www.scopus.com/inward/record.url?scp=85084018254&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85084018254
T3 - CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems, Proceedings
BT - CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems, Proceedings
PB - VDE Verlag GmbH
T2 - 8th International Conference on Integrated Power Electronics Systems, CIPS 2014
Y2 - 25 February 2014 through 27 February 2014
ER -