Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2010 IEEE CPMT Symposium Japan, ICSJ10 |
| Publikationsstatus | Veröffentlicht - 2010 |
| Veranstaltung | 2010 IEEE CPMT Symposium Japan, ICSJ10 - Tokyo, Japan Dauer: 24 Aug. 2010 → 26 Aug. 2010 |
Publikationsreihe
| Name | 2010 IEEE CPMT Symposium Japan, ICSJ10 |
|---|
Abstract
The assemblies "PoP" (Package-on-Package) can significantly increase the integration density of microelectronic circuits and systems, by vertically combining discrete semiconductor elements. Related to reliability especially migration phenomena, which are investigated here by simulation and measurements, become more important as the dimension of bumps decreases. To explore the influence of migration phenomena to the lifetime of PoPs a test card for current stress tests was designed. Furthermore, an exploration IMC growth was carried out. For a detailed interpretation of the test results FEM simulations with ANSYS® were performed. Finally, the results were used to predict the lifetime of the daisy chains and to calculate the activation energy for the IMC formation.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
2010 IEEE CPMT Symposium Japan, ICSJ10. 2010. 5679664 (2010 IEEE CPMT Symposium Japan, ICSJ10).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - PoP prototyping by determination of matter transport effects
AU - Meinshausen, L.
AU - Weide-Zaage, K.
AU - Feng, W.
AU - Frémont, H.
N1 - Copyright: Copyright 2011 Elsevier B.V., All rights reserved.
PY - 2010
Y1 - 2010
N2 - The assemblies "PoP" (Package-on-Package) can significantly increase the integration density of microelectronic circuits and systems, by vertically combining discrete semiconductor elements. Related to reliability especially migration phenomena, which are investigated here by simulation and measurements, become more important as the dimension of bumps decreases. To explore the influence of migration phenomena to the lifetime of PoPs a test card for current stress tests was designed. Furthermore, an exploration IMC growth was carried out. For a detailed interpretation of the test results FEM simulations with ANSYS® were performed. Finally, the results were used to predict the lifetime of the daisy chains and to calculate the activation energy for the IMC formation.
AB - The assemblies "PoP" (Package-on-Package) can significantly increase the integration density of microelectronic circuits and systems, by vertically combining discrete semiconductor elements. Related to reliability especially migration phenomena, which are investigated here by simulation and measurements, become more important as the dimension of bumps decreases. To explore the influence of migration phenomena to the lifetime of PoPs a test card for current stress tests was designed. Furthermore, an exploration IMC growth was carried out. For a detailed interpretation of the test results FEM simulations with ANSYS® were performed. Finally, the results were used to predict the lifetime of the daisy chains and to calculate the activation energy for the IMC formation.
UR - http://www.scopus.com/inward/record.url?scp=79251566802&partnerID=8YFLogxK
U2 - 10.1109/CPMTSYMPJ.2010.5679664
DO - 10.1109/CPMTSYMPJ.2010.5679664
M3 - Conference contribution
AN - SCOPUS:79251566802
SN - 9781424475940
T3 - 2010 IEEE CPMT Symposium Japan, ICSJ10
BT - 2010 IEEE CPMT Symposium Japan, ICSJ10
T2 - 2010 IEEE CPMT Symposium Japan, ICSJ10
Y2 - 24 August 2010 through 26 August 2010
ER -