Piezoelectrical wire feeding system for micropositioning in bonding machines

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • A. Henke
  • M. A. Kuemmel
  • J. Wallaschek

Externe Organisationen

  • Universität Paderborn
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des SammelwerksSmart Structures and Materials 1999: Smart Structures and Integrated Systems
Seiten656-664
Seitenumfang9
Band3668
AuflageII
PublikationsstatusVeröffentlicht - 9 Juni 1999
Extern publiziertJa
Veranstaltung1999 Smart Structures and Materials - Smart Structures and Integrated Systems - Newport Beach, USA / Vereinigte Staaten
Dauer: 1 März 19991 März 1999

Publikationsreihe

NameProceedings of SPIE - The International Society for Optical Engineering
Herausgeber (Verlag)SPIE
ISSN (Print)0277-786X

Abstract

In this report a new wire feeding system for fine wire bonding machines and its development is presented. The system is driven by a piezoelectric actuator, which replaces the electromagnetic actuators used in present bonding machines. To minimize the time used to develop the piezoelectric system, several models of the system have been derived and simulations have been made, to optimize the systems performance. After the wire feeding system has been manufactured, experiments have been made to validate the results conceived from the simulations. The performance improvement to the currently used feeding system is discussed.

ASJC Scopus Sachgebiete

Zitieren

Piezoelectrical wire feeding system for micropositioning in bonding machines. / Henke, A.; Kuemmel, M. A.; Wallaschek, J.
Smart Structures and Materials 1999: Smart Structures and Integrated Systems. Band 3668 II. Aufl. 1999. S. 656-664 (Proceedings of SPIE - The International Society for Optical Engineering).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Henke, A, Kuemmel, MA & Wallaschek, J 1999, Piezoelectrical wire feeding system for micropositioning in bonding machines. in Smart Structures and Materials 1999: Smart Structures and Integrated Systems. II Aufl., Bd. 3668, Proceedings of SPIE - The International Society for Optical Engineering, S. 656-664, 1999 Smart Structures and Materials - Smart Structures and Integrated Systems, Newport Beach, California, USA / Vereinigte Staaten, 1 März 1999. https://doi.org/10.1117/12.350740
Henke, A., Kuemmel, M. A., & Wallaschek, J. (1999). Piezoelectrical wire feeding system for micropositioning in bonding machines. In Smart Structures and Materials 1999: Smart Structures and Integrated Systems (II Aufl., Band 3668, S. 656-664). (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.350740
Henke A, Kuemmel MA, Wallaschek J. Piezoelectrical wire feeding system for micropositioning in bonding machines. in Smart Structures and Materials 1999: Smart Structures and Integrated Systems. II Aufl. Band 3668. 1999. S. 656-664. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.350740
Henke, A. ; Kuemmel, M. A. ; Wallaschek, J. / Piezoelectrical wire feeding system for micropositioning in bonding machines. Smart Structures and Materials 1999: Smart Structures and Integrated Systems. Band 3668 II. Aufl. 1999. S. 656-664 (Proceedings of SPIE - The International Society for Optical Engineering).
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