Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates

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OriginalspracheEnglisch
Titel des Sammelwerks2020 IEEE Photonics Conference, IPC 2020
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
ISBN (elektronisch)9781728158914
ISBN (Print)978-1-7281-5892-1
PublikationsstatusVeröffentlicht - 2020
Veranstaltung2020 IEEE Photonics Conference, IPC 2020 - Virtual, Vancouver, Kanada
Dauer: 28 Sept. 20201 Okt. 2020

Abstract

The thermal management of optical components on polymer substrates is crucial. Active components such as laser diodes produce heat which degenerates polymer substrates. Therefore, a thermal management concept is addressed to run active components within their specifications as well as keeping the substrate from damage.

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Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. / Bengsch, Sebastian; Wurz, Marc Christopher.
2020 IEEE Photonics Conference, IPC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9252383.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Bengsch, S & Wurz, MC 2020, Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. in 2020 IEEE Photonics Conference, IPC 2020., 9252383, Institute of Electrical and Electronics Engineers Inc., 2020 IEEE Photonics Conference, IPC 2020, Virtual, Vancouver, Kanada, 28 Sept. 2020. https://doi.org/10.1109/IPC47351.2020.9252383
Bengsch, S., & Wurz, M. C. (2020). Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. In 2020 IEEE Photonics Conference, IPC 2020 Artikel 9252383 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IPC47351.2020.9252383
Bengsch S, Wurz MC. Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. in 2020 IEEE Photonics Conference, IPC 2020. Institute of Electrical and Electronics Engineers Inc. 2020. 9252383 doi: 10.1109/IPC47351.2020.9252383
Bengsch, Sebastian ; Wurz, Marc Christopher. / Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates. 2020 IEEE Photonics Conference, IPC 2020. Institute of Electrical and Electronics Engineers Inc., 2020.
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title = "Passive and Active Thermal Management of Bonded Bare-Dice Laser Diodes on Polymer Foil Substrates",
abstract = "The thermal management of optical components on polymer substrates is crucial. Active components such as laser diodes produce heat which degenerates polymer substrates. Therefore, a thermal management concept is addressed to run active components within their specifications as well as keeping the substrate from damage.",
keywords = "active cooling, bonding, foil substrates, laser diodes, passive cooling, polymer, soldering, thermal management",
author = "Sebastian Bengsch and Wurz, {Marc Christopher}",
note = "Funding Information: I would like to thank the Cluster of Excellence PhoenixD (Photonics, Optics, and Engineering – Innovation Across Disciplines), Hannover, Germany funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany{\textquoteright}s Excellence Strategy within the Cluster of Excellence PhoenixD (EXC 2122, Project ID 390833453); 2020 IEEE Photonics Conference, IPC 2020 ; Conference date: 28-09-2020 Through 01-10-2020",
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AU - Bengsch, Sebastian

AU - Wurz, Marc Christopher

N1 - Funding Information: I would like to thank the Cluster of Excellence PhoenixD (Photonics, Optics, and Engineering – Innovation Across Disciplines), Hannover, Germany funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany’s Excellence Strategy within the Cluster of Excellence PhoenixD (EXC 2122, Project ID 390833453)

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KW - active cooling

KW - bonding

KW - foil substrates

KW - laser diodes

KW - passive cooling

KW - polymer

KW - soldering

KW - thermal management

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M3 - Conference contribution

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