Numerical simulations of buried emitter back-junction solar cells

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • Nils P. Harder
  • Verena Mertens
  • Rolf Brendel

Externe Organisationen

  • Institut für Solarenergieforschung GmbH (ISFH)
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Details

OriginalspracheEnglisch
Seiten (von - bis)253-263
Seitenumfang11
FachzeitschriftProgress in Photovoltaics: Research and Applications
Jahrgang17
Ausgabenummer4
PublikationsstatusVeröffentlicht - Juni 2009
Extern publiziertJa

Abstract

We recently introduced the buried emitter back-junction solar cell, featuring large area fractions of overlap between n +-type and p +-type regions at the rear side of the device. In this paper we analyse the performance of the buried emitter solar cell (BESC) and its generalisations by one-dimensional device simulations and analytical model calculations. A key finding is that the generalised versions of the BESC structure allows achieving very high efficiencies by passivating virtually the entire surface of p-type emitters by an oxidised n-type surface layer. A disadvantage of this type of full-area emitter passivation in the generalised back-junction BESC is the need for an insulating layer between the metallisation of the emitter and the contact to the base, which is technologically difficult to achieve.

ASJC Scopus Sachgebiete

Ziele für nachhaltige Entwicklung

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Numerical simulations of buried emitter back-junction solar cells. / Harder, Nils P.; Mertens, Verena; Brendel, Rolf.
in: Progress in Photovoltaics: Research and Applications, Jahrgang 17, Nr. 4, 06.2009, S. 253-263.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Harder NP, Mertens V, Brendel R. Numerical simulations of buried emitter back-junction solar cells. Progress in Photovoltaics: Research and Applications. 2009 Jun;17(4):253-263. doi: 10.1002/pip.887
Harder, Nils P. ; Mertens, Verena ; Brendel, Rolf. / Numerical simulations of buried emitter back-junction solar cells. in: Progress in Photovoltaics: Research and Applications. 2009 ; Jahrgang 17, Nr. 4. S. 253-263.
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