n-type polysilicon by PVD enabling self-aligned back contact solar cells

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • Erik Hoffmann
  • Philip Jäger
  • Geoffrey Gregory
  • Muhammad Khan
  • Nabeel Khan
  • Thorsten Dullweber
  • Rolf Brendel
  • Massimo Centazzo

Organisationseinheiten

Externe Organisationen

  • EnPV GmbH
  • Institut für Solarenergieforschung GmbH (ISFH)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des SammelwerksIEEE 52nd Photovoltaic Specialist Conference
UntertitelPVSC 2024
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten1686-1689
Seitenumfang4
ISBN (elektronisch)9781665464260
ISBN (Print)978-1-6654-7582-2
PublikationsstatusVeröffentlicht - 9 Juni 2024
Veranstaltung52nd IEEE Photovoltaic Specialist Conference, PVSC 2024 - Seattle, USA / Vereinigte Staaten
Dauer: 9 Juni 202414 Juni 2024

Publikationsreihe

NameConference Record of the IEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371

Abstract

We introduce a novel approach to streamline the processing sequence of fully passivated interdigitated back contact (IBC) solar cells by employing self-aligned separation of the poly-silicon layers. The proposed method for such n-type self-aligned back contact (SABC) solar cell exploits a laser-structured and under-etched p-type poly-Si layer to locally separate a subsequent directionally deposited n-type poly-Silicon layer by physical vapor deposition (PVD). While the n-type poly-Si layer covers the fully exposed rear surface, it is interrupted at the trenches. Consequently, the base contact is formed by the n-type poly-Si only, but the emitter is formed by a stack consisting of a p-type poly and a n-type poly-Silicon layer. Due to the high doping concentration this layer stack is targeted to form a low-resistive tunnelling junction. Since the n-type poly caps both emitter and base contact, it allows a single metallisation step using the same paste for both polarities. Moreover, this innovative technique offers reduced processing steps and enables ultra-fine separation of the poly-Silicon layers, which in turn allows a narrow finger pitch. The n-type poly-Si deposited by PVD on the full wafer area yields an excellent open circuit voltage iVoc=738 mV and SEM images show a separation of the n-type poly-Si layer across the trench edge. Implementing this isolation technique of the n-type poly layer on passivated IBC solar cells will enable a self-aligned separation with just one structuring process step.

ASJC Scopus Sachgebiete

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n-type polysilicon by PVD enabling self-aligned back contact solar cells. / Hoffmann, Erik; Jäger, Philip; Gregory, Geoffrey et al.
IEEE 52nd Photovoltaic Specialist Conference: PVSC 2024. Institute of Electrical and Electronics Engineers Inc., 2024. S. 1686-1689 (Conference Record of the IEEE Photovoltaic Specialists Conference).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Hoffmann, E, Jäger, P, Gregory, G, Khan, M, Khan, N, Dullweber, T, Brendel, R & Centazzo, M 2024, n-type polysilicon by PVD enabling self-aligned back contact solar cells. in IEEE 52nd Photovoltaic Specialist Conference: PVSC 2024. Conference Record of the IEEE Photovoltaic Specialists Conference, Institute of Electrical and Electronics Engineers Inc., S. 1686-1689, 52nd IEEE Photovoltaic Specialist Conference, PVSC 2024, Seattle, USA / Vereinigte Staaten, 9 Juni 2024. https://doi.org/10.1109/PVSC57443.2024.10749366
Hoffmann, E., Jäger, P., Gregory, G., Khan, M., Khan, N., Dullweber, T., Brendel, R., & Centazzo, M. (2024). n-type polysilicon by PVD enabling self-aligned back contact solar cells. In IEEE 52nd Photovoltaic Specialist Conference: PVSC 2024 (S. 1686-1689). (Conference Record of the IEEE Photovoltaic Specialists Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC57443.2024.10749366
Hoffmann E, Jäger P, Gregory G, Khan M, Khan N, Dullweber T et al. n-type polysilicon by PVD enabling self-aligned back contact solar cells. in IEEE 52nd Photovoltaic Specialist Conference: PVSC 2024. Institute of Electrical and Electronics Engineers Inc. 2024. S. 1686-1689. (Conference Record of the IEEE Photovoltaic Specialists Conference). doi: 10.1109/PVSC57443.2024.10749366
Hoffmann, Erik ; Jäger, Philip ; Gregory, Geoffrey et al. / n-type polysilicon by PVD enabling self-aligned back contact solar cells. IEEE 52nd Photovoltaic Specialist Conference: PVSC 2024. Institute of Electrical and Electronics Engineers Inc., 2024. S. 1686-1689 (Conference Record of the IEEE Photovoltaic Specialists Conference).
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abstract = "We introduce a novel approach to streamline the processing sequence of fully passivated interdigitated back contact (IBC) solar cells by employing self-aligned separation of the poly-silicon layers. The proposed method for such n-type self-aligned back contact (SABC) solar cell exploits a laser-structured and under-etched p-type poly-Si layer to locally separate a subsequent directionally deposited n-type poly-Silicon layer by physical vapor deposition (PVD). While the n-type poly-Si layer covers the fully exposed rear surface, it is interrupted at the trenches. Consequently, the base contact is formed by the n-type poly-Si only, but the emitter is formed by a stack consisting of a p-type poly and a n-type poly-Silicon layer. Due to the high doping concentration this layer stack is targeted to form a low-resistive tunnelling junction. Since the n-type poly caps both emitter and base contact, it allows a single metallisation step using the same paste for both polarities. Moreover, this innovative technique offers reduced processing steps and enables ultra-fine separation of the poly-Silicon layers, which in turn allows a narrow finger pitch. The n-type poly-Si deposited by PVD on the full wafer area yields an excellent open circuit voltage iVoc=738 mV and SEM images show a separation of the n-type poly-Si layer across the trench edge. Implementing this isolation technique of the n-type poly layer on passivated IBC solar cells will enable a self-aligned separation with just one structuring process step.",
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AU - Hoffmann, Erik

AU - Jäger, Philip

AU - Gregory, Geoffrey

AU - Khan, Muhammad

AU - Khan, Nabeel

AU - Dullweber, Thorsten

AU - Brendel, Rolf

AU - Centazzo, Massimo

N1 - Publisher Copyright: © 2024 IEEE.

PY - 2024/6/9

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N2 - We introduce a novel approach to streamline the processing sequence of fully passivated interdigitated back contact (IBC) solar cells by employing self-aligned separation of the poly-silicon layers. The proposed method for such n-type self-aligned back contact (SABC) solar cell exploits a laser-structured and under-etched p-type poly-Si layer to locally separate a subsequent directionally deposited n-type poly-Silicon layer by physical vapor deposition (PVD). While the n-type poly-Si layer covers the fully exposed rear surface, it is interrupted at the trenches. Consequently, the base contact is formed by the n-type poly-Si only, but the emitter is formed by a stack consisting of a p-type poly and a n-type poly-Silicon layer. Due to the high doping concentration this layer stack is targeted to form a low-resistive tunnelling junction. Since the n-type poly caps both emitter and base contact, it allows a single metallisation step using the same paste for both polarities. Moreover, this innovative technique offers reduced processing steps and enables ultra-fine separation of the poly-Silicon layers, which in turn allows a narrow finger pitch. The n-type poly-Si deposited by PVD on the full wafer area yields an excellent open circuit voltage iVoc=738 mV and SEM images show a separation of the n-type poly-Si layer across the trench edge. Implementing this isolation technique of the n-type poly layer on passivated IBC solar cells will enable a self-aligned separation with just one structuring process step.

AB - We introduce a novel approach to streamline the processing sequence of fully passivated interdigitated back contact (IBC) solar cells by employing self-aligned separation of the poly-silicon layers. The proposed method for such n-type self-aligned back contact (SABC) solar cell exploits a laser-structured and under-etched p-type poly-Si layer to locally separate a subsequent directionally deposited n-type poly-Silicon layer by physical vapor deposition (PVD). While the n-type poly-Si layer covers the fully exposed rear surface, it is interrupted at the trenches. Consequently, the base contact is formed by the n-type poly-Si only, but the emitter is formed by a stack consisting of a p-type poly and a n-type poly-Silicon layer. Due to the high doping concentration this layer stack is targeted to form a low-resistive tunnelling junction. Since the n-type poly caps both emitter and base contact, it allows a single metallisation step using the same paste for both polarities. Moreover, this innovative technique offers reduced processing steps and enables ultra-fine separation of the poly-Silicon layers, which in turn allows a narrow finger pitch. The n-type poly-Si deposited by PVD on the full wafer area yields an excellent open circuit voltage iVoc=738 mV and SEM images show a separation of the n-type poly-Si layer across the trench edge. Implementing this isolation technique of the n-type poly layer on passivated IBC solar cells will enable a self-aligned separation with just one structuring process step.

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