Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2019 IEEE Sensors, SENSORS 2019 |
| Untertitel | Proceedings |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seitenumfang | 4 |
| ISBN (elektronisch) | 978-1-7281-1634-1 |
| ISBN (Print) | 978-1-7281-1635-8 |
| Publikationsstatus | Veröffentlicht - Okt. 2019 |
| Veranstaltung | 18th IEEE Sensors (SENSORS 2019) - Montreal, Kanada Dauer: 27 Okt. 2019 → 30 Okt. 2019 Konferenznummer: 18 |
Publikationsreihe
| Name | Proceedings of IEEE Sensors |
|---|---|
| Band | 2019-October |
| ISSN (Print) | 1930-0395 |
| ISSN (elektronisch) | 2168-9229 |
Abstract
A novel eddy-current sensor for monitoring the material flow in deep-drawing processes has been developed via thin-film technology. Using a stainless steel substrate, on which the sensor coil is directly fabricated, as protection provides the high wear and pressure resistance required for an application in serial production. Furthermore, the weakening of the tool that follows the installation of the sensor can be reduced due to the minor size of the sensor. Within this paper, an optimized sensor layout is developed based on a 2D-finite-element simulation. The influence of various parameters e.g. the coil's geometry on the sensor sensitivity is investigated leading to beneficial guidelines for designing an eddy-current draw-in sensor. Measurements of the manufactured sensor prove the viability of the simulation. In addition, sensor fabrication is revealed in detail.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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- BibTex
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2019 IEEE Sensors, SENSORS 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8956948 (Proceedings of IEEE Sensors; Band 2019-October).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Novel Eddy-Current Sensor for Industrial Deep-Drawing Applications
AU - Arndt, Matthias
AU - Dencker, Folke
AU - Wurz, Marc Christopher
N1 - Conference code: 18
PY - 2019/10
Y1 - 2019/10
N2 - A novel eddy-current sensor for monitoring the material flow in deep-drawing processes has been developed via thin-film technology. Using a stainless steel substrate, on which the sensor coil is directly fabricated, as protection provides the high wear and pressure resistance required for an application in serial production. Furthermore, the weakening of the tool that follows the installation of the sensor can be reduced due to the minor size of the sensor. Within this paper, an optimized sensor layout is developed based on a 2D-finite-element simulation. The influence of various parameters e.g. the coil's geometry on the sensor sensitivity is investigated leading to beneficial guidelines for designing an eddy-current draw-in sensor. Measurements of the manufactured sensor prove the viability of the simulation. In addition, sensor fabrication is revealed in detail.
AB - A novel eddy-current sensor for monitoring the material flow in deep-drawing processes has been developed via thin-film technology. Using a stainless steel substrate, on which the sensor coil is directly fabricated, as protection provides the high wear and pressure resistance required for an application in serial production. Furthermore, the weakening of the tool that follows the installation of the sensor can be reduced due to the minor size of the sensor. Within this paper, an optimized sensor layout is developed based on a 2D-finite-element simulation. The influence of various parameters e.g. the coil's geometry on the sensor sensitivity is investigated leading to beneficial guidelines for designing an eddy-current draw-in sensor. Measurements of the manufactured sensor prove the viability of the simulation. In addition, sensor fabrication is revealed in detail.
KW - deep-drawing
KW - eddy-current sensor
KW - finite-element analysis
KW - inductive sensor
KW - material flow measurement
UR - http://www.scopus.com/inward/record.url?scp=85078705775&partnerID=8YFLogxK
U2 - 10.1109/SENSORS43011.2019.8956948
DO - 10.1109/SENSORS43011.2019.8956948
M3 - Conference contribution
AN - SCOPUS:85078705775
SN - 978-1-7281-1635-8
T3 - Proceedings of IEEE Sensors
BT - 2019 IEEE Sensors, SENSORS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th IEEE Sensors (SENSORS 2019)
Y2 - 27 October 2019 through 30 October 2019
ER -