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Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandBeitrag in Buch/SammelwerkForschungPeer-Review

Autorschaft

  • Bilen Emek Abali
  • Fadi Aldakheel
  • Tarek I. Zohdi

Organisationseinheiten

Externe Organisationen

  • Uppsala University
  • University of California at Berkeley
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    • Citation Indexes: 4
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    • Readers: 1
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Details

OriginalspracheEnglisch
Titel des SammelwerksCurrent Trends and Open Problems in Computational Mechanics
Herausgeber (Verlag)Springer International Publishing AG
Seiten1-14
Seitenumfang14
ISBN (elektronisch)9783030873127
ISBN (Print)9783030873110
PublikationsstatusElektronisch veröffentlicht (E-Pub) - 13 März 2022

Abstract

Miniaturization increases more complexity in Integrated Circuits (IC) as well as circuit boards. Several electronic components are assembled on a Printed Circuit Board (PCB). The board is a composite material of a fiber reinforced thermosetting polymer based matrix. Within and on the board, conducting traces and vertical interconnect access (via) carry out electrical signals. So-called Joule’s heat causes a cyclic occurrence of thermal stresses on vias and traces leading to plastic deformation and fatigue related damage. Multiphysics simulations make a study of this coupled and nonlinear system possible. We demonstrate an attempt to compute an electro-thermo-mechanical system and a damage problem by using finite element method in space and finite difference method in time.

ASJC Scopus Sachgebiete

Zitieren

Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading. / Abali, Bilen Emek; Aldakheel, Fadi; Zohdi, Tarek I.
Current Trends and Open Problems in Computational Mechanics. Springer International Publishing AG, 2022. S. 1-14.

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandBeitrag in Buch/SammelwerkForschungPeer-Review

Abali, BE, Aldakheel, F & Zohdi, TI 2022, Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading. in Current Trends and Open Problems in Computational Mechanics. Springer International Publishing AG, S. 1-14. https://doi.org/10.1007/978-3-030-87312-7_1
Abali, B. E., Aldakheel, F., & Zohdi, T. I. (2022). Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading. In Current Trends and Open Problems in Computational Mechanics (S. 1-14). Springer International Publishing AG. Vorabveröffentlichung online. https://doi.org/10.1007/978-3-030-87312-7_1
Abali BE, Aldakheel F, Zohdi TI. Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading. in Current Trends and Open Problems in Computational Mechanics. Springer International Publishing AG. 2022. S. 1-14 Epub 2022 Mär 13. doi: 10.1007/978-3-030-87312-7_1
Abali, Bilen Emek ; Aldakheel, Fadi ; Zohdi, Tarek I. / Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading. Current Trends and Open Problems in Computational Mechanics. Springer International Publishing AG, 2022. S. 1-14
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