Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 1662-1667 |
| Seitenumfang | 6 |
| Fachzeitschrift | Microelectronics reliability |
| Jahrgang | 45 |
| Ausgabenummer | 9-11 |
| Publikationsstatus | Veröffentlicht - Sept. 2005 |
Abstract
When printed circuit boards (PCBs) are exposed to humid ambient conditions an absorption of moisture will occur. This infects the reliability of the PCB and also delamination can occur during reflow. Copper layers in the PCB act as diffusion barrier and have an influence of the moisture distribution and out of this an influence on the moisture concentration in the PCB. Depending on the location the time to get dry PCB increases. In this paper the measurement of different PCB samples will be compared with concentration distribution out of simulations.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: Microelectronics reliability, Jahrgang 45, Nr. 9-11, 09.2005, S. 1662-1667.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Moisture diffusion in printed circuit boards
T2 - Measurements and finite- element- simulations
AU - Weide-Zaage, Kirsten
AU - Horaud, Walter
AU - Frémont, Hélène
N1 - Copyright: Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2005/9
Y1 - 2005/9
N2 - When printed circuit boards (PCBs) are exposed to humid ambient conditions an absorption of moisture will occur. This infects the reliability of the PCB and also delamination can occur during reflow. Copper layers in the PCB act as diffusion barrier and have an influence of the moisture distribution and out of this an influence on the moisture concentration in the PCB. Depending on the location the time to get dry PCB increases. In this paper the measurement of different PCB samples will be compared with concentration distribution out of simulations.
AB - When printed circuit boards (PCBs) are exposed to humid ambient conditions an absorption of moisture will occur. This infects the reliability of the PCB and also delamination can occur during reflow. Copper layers in the PCB act as diffusion barrier and have an influence of the moisture distribution and out of this an influence on the moisture concentration in the PCB. Depending on the location the time to get dry PCB increases. In this paper the measurement of different PCB samples will be compared with concentration distribution out of simulations.
UR - http://www.scopus.com/inward/record.url?scp=24144473145&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2005.07.077
DO - 10.1016/j.microrel.2005.07.077
M3 - Article
AN - SCOPUS:24144473145
VL - 45
SP - 1662
EP - 1667
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 9-11
ER -