Modeling recombination and contact resistance of poly-Si junctions

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • Nils Folchert
  • Robby Peibst
  • Rolf Brendel

Externe Organisationen

  • Institut für Solarenergieforschung GmbH (ISFH)
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Details

OriginalspracheEnglisch
Seiten (von - bis)1289-1307
Seitenumfang19
FachzeitschriftProgress in Photovoltaics: Research and Applications
Jahrgang28
Ausgabenummer12
Frühes Online-Datum24 Aug. 2020
PublikationsstatusVeröffentlicht - 27 Nov. 2020

Abstract

We present a semi-analytical model for the calculation of the current through and the recombination in carrier-selective junctions consisting of a poly-Si/SiOx/c-Si layer stack. We calculate the recombination parameter J0 and the contact resistance ρC after solving the band-bending-problem on both sides of the interfacial oxide. Comparisons with finite-element simulations show that the current calculation is reliable at all bias conditions except for inversion and that current through pinholes is resolved adequately in the model. The model allows a coherent description of lifetime-, current-voltage- and capacitance-voltage measurements performed on a sample with dominant tunneling. We use our model to investigate the influence of oxide thickness and pinhole density on J0 and ρC of our state-of-the-art poly-silicon-on-oxide (POLO) junctions and demonstrate its usefulness for the optimization of poly-Si based junctions.

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Ziele für nachhaltige Entwicklung

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Modeling recombination and contact resistance of poly-Si junctions. / Folchert, Nils; Peibst, Robby; Brendel, Rolf.
in: Progress in Photovoltaics: Research and Applications, Jahrgang 28, Nr. 12, 27.11.2020, S. 1289-1307.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Folchert N, Peibst R, Brendel R. Modeling recombination and contact resistance of poly-Si junctions. Progress in Photovoltaics: Research and Applications. 2020 Nov 27;28(12):1289-1307. Epub 2020 Aug 24. doi: 10.1002/pip.3327
Folchert, Nils ; Peibst, Robby ; Brendel, Rolf. / Modeling recombination and contact resistance of poly-Si junctions. in: Progress in Photovoltaics: Research and Applications. 2020 ; Jahrgang 28, Nr. 12. S. 1289-1307.
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N1 - Funding Information: We gratefully thank Guido Glowatzki for the sample preparation, Audie Adam Yeo and Liz Montanez for help with measurements, and Uwe Rau for helpful discussions. This work was supported by the Ministry of Science and Culture of lower Saxony in the framework of the project vOx and has also received funding from the European Union's Horizon 2020 research and innovation program under grant agreement no 727529 (DISC).

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N2 - We present a semi-analytical model for the calculation of the current through and the recombination in carrier-selective junctions consisting of a poly-Si/SiOx/c-Si layer stack. We calculate the recombination parameter J0 and the contact resistance ρC after solving the band-bending-problem on both sides of the interfacial oxide. Comparisons with finite-element simulations show that the current calculation is reliable at all bias conditions except for inversion and that current through pinholes is resolved adequately in the model. The model allows a coherent description of lifetime-, current-voltage- and capacitance-voltage measurements performed on a sample with dominant tunneling. We use our model to investigate the influence of oxide thickness and pinhole density on J0 and ρC of our state-of-the-art poly-silicon-on-oxide (POLO) junctions and demonstrate its usefulness for the optimization of poly-Si based junctions.

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