Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | ASME 2005 International Mechanical Engineering Congress and Exposition (IMECE2005) |
| Seiten | 219-226 |
| Seitenumfang | 8 |
| Publikationsstatus | Veröffentlicht - 5 Feb. 2005 |
| Extern publiziert | Ja |
| Veranstaltung | 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005 - Orlando, FL, USA / Vereinigte Staaten Dauer: 5 Nov. 2005 → 11 Nov. 2005 |
Publikationsreihe
| Name | International Mechanical Engineering Congress and Exposition (IMECE) |
|---|
Abstract
Quality monitoring in microelectronics becomes more and more important because of the constantly rising complexity and miniaturization of modern microelectronic devices. This paper describes a model based method for online quality monitoring in ultrasonic wire bonding. This new approach aims to reconstruct the metallophysical processes within the bonding zone by the aid of a validated analytical model of the bonding system. The model comprises a 2-DOF electromechanical analogous circuit representing the ultrasonic transducer, a phase-locked-loop controller for frequency control and time varying spring-damper elements representing the bond process. It will be shown how faulty bonds can clearly be identified by this method.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Maschinenbau
- Erdkunde und Planetologie (insg.)
- Astronomie und Planetologie
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ASME 2005 International Mechanical Engineering Congress and Exposition (IMECE2005). 2005. S. 219-226 (International Mechanical Engineering Congress and Exposition (IMECE)).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Model based development of an integrated sensor-actuator system for online quality monitoring in ultrasonic wire bonding
AU - Brökelmann, Michael
AU - Wallaschek, Jörg
AU - Hesse, Hans J.
N1 - Copyright: Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2005/2/5
Y1 - 2005/2/5
N2 - Quality monitoring in microelectronics becomes more and more important because of the constantly rising complexity and miniaturization of modern microelectronic devices. This paper describes a model based method for online quality monitoring in ultrasonic wire bonding. This new approach aims to reconstruct the metallophysical processes within the bonding zone by the aid of a validated analytical model of the bonding system. The model comprises a 2-DOF electromechanical analogous circuit representing the ultrasonic transducer, a phase-locked-loop controller for frequency control and time varying spring-damper elements representing the bond process. It will be shown how faulty bonds can clearly be identified by this method.
AB - Quality monitoring in microelectronics becomes more and more important because of the constantly rising complexity and miniaturization of modern microelectronic devices. This paper describes a model based method for online quality monitoring in ultrasonic wire bonding. This new approach aims to reconstruct the metallophysical processes within the bonding zone by the aid of a validated analytical model of the bonding system. The model comprises a 2-DOF electromechanical analogous circuit representing the ultrasonic transducer, a phase-locked-loop controller for frequency control and time varying spring-damper elements representing the bond process. It will be shown how faulty bonds can clearly be identified by this method.
KW - Model based
KW - Quality monitoring
KW - Transient load estimation
KW - Ultrasonic wire bonding
UR - http://www.scopus.com/inward/record.url?scp=33645660302&partnerID=8YFLogxK
U2 - 10.1115/IMECE2005-80790
DO - 10.1115/IMECE2005-80790
M3 - Conference contribution
AN - SCOPUS:33645660302
SN - 079184210X
SN - 9780791842102
T3 - International Mechanical Engineering Congress and Exposition (IMECE)
SP - 219
EP - 226
BT - ASME 2005 International Mechanical Engineering Congress and Exposition (IMECE2005)
T2 - 2005 ASME International Mechanical Engineering Congress and Exposition, IMECE 2005
Y2 - 5 November 2005 through 11 November 2005
ER -