Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 1860-1864 |
| Seitenumfang | 5 |
| Fachzeitschrift | Microelectronics reliability |
| Jahrgang | 51 |
| Ausgabenummer | 9-11 |
| Publikationsstatus | Veröffentlicht - Sept. 2011 |
Abstract
Microbumps consisting of intermetallic compounds like Cu6Sn 5 or Cu3Sn have a longer lifetime during electromigration tests than SnAgCu microbumps. To explain the difference in behavior of Cu-Sn IMCs and SnAgCu during stress test the migration induced mass flux was calculated for Cu3Sn and Cu6Sn5. The results were compared to the mass flux in SnAgCu 305. Furthermore average effective charge values for Cu3Sn and Cu6Sn5 were approximated by comparing the separated movement of Cu and Sn with three different models for an averaged mass flux in the IMCs.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: Microelectronics reliability, Jahrgang 51, Nr. 9-11, 09.2011, S. 1860-1864.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps
AU - Meinshausen, L.
AU - Weide-Zaage, K.
AU - Frémont, H.
N1 - Funding Information: This collaboration was supported by PROCOPE PKZ D/0811472. This program is founded by the DAAD financed by the BMBF and French Ministry of Foreign Affairs. Copyright: Copyright 2011 Elsevier B.V., All rights reserved.
PY - 2011/9
Y1 - 2011/9
N2 - Microbumps consisting of intermetallic compounds like Cu6Sn 5 or Cu3Sn have a longer lifetime during electromigration tests than SnAgCu microbumps. To explain the difference in behavior of Cu-Sn IMCs and SnAgCu during stress test the migration induced mass flux was calculated for Cu3Sn and Cu6Sn5. The results were compared to the mass flux in SnAgCu 305. Furthermore average effective charge values for Cu3Sn and Cu6Sn5 were approximated by comparing the separated movement of Cu and Sn with three different models for an averaged mass flux in the IMCs.
AB - Microbumps consisting of intermetallic compounds like Cu6Sn 5 or Cu3Sn have a longer lifetime during electromigration tests than SnAgCu microbumps. To explain the difference in behavior of Cu-Sn IMCs and SnAgCu during stress test the migration induced mass flux was calculated for Cu3Sn and Cu6Sn5. The results were compared to the mass flux in SnAgCu 305. Furthermore average effective charge values for Cu3Sn and Cu6Sn5 were approximated by comparing the separated movement of Cu and Sn with three different models for an averaged mass flux in the IMCs.
UR - http://www.scopus.com/inward/record.url?scp=80052950524&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2011.06.032
DO - 10.1016/j.microrel.2011.06.032
M3 - Article
AN - SCOPUS:80052950524
VL - 51
SP - 1860
EP - 1864
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 9-11
ER -