Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 1827-1832 |
| Seitenumfang | 6 |
| Fachzeitschrift | Microelectronics reliability |
| Jahrgang | 52 |
| Ausgabenummer | 9-10 |
| Publikationsstatus | Veröffentlicht - Sept. 2012 |
Abstract
Because of material movements intermetallic compound layers are formed between metal layers and solder joints. These intermetallics affect the reliability of the solder joints by reducing their lifetime during drop test or by accelerating the migration induced void formation. This study investigates the migration kinetics of Cu, Ni, Au and Sn in SAC305 solder joints on three different metal layers: Cu, NiAu and NiP. The aim of this study is the identification and description of migration processes during aging of solder joints with one and double sided Ni diffusion barriers.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: Microelectronics reliability, Jahrgang 52, Nr. 9-10, 09.2012, S. 1827-1832.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers
AU - Meinshausen, L.
AU - Frémont, H.
AU - Weide-Zaage, K.
N1 - Copyright: Copyright 2012 Elsevier B.V., All rights reserved.
PY - 2012/9
Y1 - 2012/9
N2 - Because of material movements intermetallic compound layers are formed between metal layers and solder joints. These intermetallics affect the reliability of the solder joints by reducing their lifetime during drop test or by accelerating the migration induced void formation. This study investigates the migration kinetics of Cu, Ni, Au and Sn in SAC305 solder joints on three different metal layers: Cu, NiAu and NiP. The aim of this study is the identification and description of migration processes during aging of solder joints with one and double sided Ni diffusion barriers.
AB - Because of material movements intermetallic compound layers are formed between metal layers and solder joints. These intermetallics affect the reliability of the solder joints by reducing their lifetime during drop test or by accelerating the migration induced void formation. This study investigates the migration kinetics of Cu, Ni, Au and Sn in SAC305 solder joints on three different metal layers: Cu, NiAu and NiP. The aim of this study is the identification and description of migration processes during aging of solder joints with one and double sided Ni diffusion barriers.
UR - http://www.scopus.com/inward/record.url?scp=84866735376&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2012.06.127
DO - 10.1016/j.microrel.2012.06.127
M3 - Article
AN - SCOPUS:84866735376
VL - 52
SP - 1827
EP - 1832
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 9-10
ER -