Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 995-1001 |
| Seitenumfang | 7 |
| Fachzeitschrift | IEEE International Test Conference (TC) |
| Jahrgang | 2001 |
| Publikationsstatus | Veröffentlicht - 1 Jan. 2001 |
| Extern publiziert | Ja |
Abstract
A word oriented memory Built-In Self-Repair methodology is described without modifying the memory module. Faulty addresses and its data will be stored in the redundancy logic immediately after its detection during test. Fuse boxes can be connected via scan registers to the redundancy logic.
Schlagwörter
- Built-In Self-repair, Memory Test, Production Test
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Mathematik (insg.)
- Angewandte Mathematik
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in: IEEE International Test Conference (TC), Jahrgang 2001, 01.01.2001, S. 995-1001.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Memory Built-In Self-Repair using redundant words
AU - Schöber, Volker
AU - Paul, Steffen
AU - Picot, Olivier
PY - 2001/1/1
Y1 - 2001/1/1
N2 - A word oriented memory Built-In Self-Repair methodology is described without modifying the memory module. Faulty addresses and its data will be stored in the redundancy logic immediately after its detection during test. Fuse boxes can be connected via scan registers to the redundancy logic.
AB - A word oriented memory Built-In Self-Repair methodology is described without modifying the memory module. Faulty addresses and its data will be stored in the redundancy logic immediately after its detection during test. Fuse boxes can be connected via scan registers to the redundancy logic.
KW - BISR
KW - BIST
KW - Built-In Self-Repair
KW - Field test
KW - Fuse boxes
KW - Memory test
KW - Built-In Self-repair
KW - Memory Test
KW - Production Test
UR - http://www.scopus.com/inward/record.url?scp=0035687345&partnerID=8YFLogxK
U2 - 10.1109/TEST.2001.966724
DO - 10.1109/TEST.2001.966724
M3 - Article
AN - SCOPUS:0035687345
VL - 2001
SP - 995
EP - 1001
JO - IEEE International Test Conference (TC)
JF - IEEE International Test Conference (TC)
SN - 1089-3539
ER -