Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits |
| Publikationsstatus | Veröffentlicht - 2010 |
| Veranstaltung | 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010 - Singapore, Singapur Dauer: 5 Juli 2010 → 9 Juli 2010 |
Publikationsreihe
| Name | Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA |
|---|
Abstract
The influence of the via bottom geometry on stress development in Cu interconnects is investigated by FE-Simulation. The mechanical characterization shows the weakest link concerning the reliability of the different via geometries. The via with the cone-shaped bottom seems to have the best reliability with respect to mechanical stress.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits. 2010. 5532227 (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Mechanical characterization of copper based metallizations with different via-bottom geometries
AU - Ciptokusumo, Johar
AU - Weide-Zaage, Kirsten
AU - Aubel, Oliver
N1 - Copyright: Copyright 2010 Elsevier B.V., All rights reserved.
PY - 2010
Y1 - 2010
N2 - The influence of the via bottom geometry on stress development in Cu interconnects is investigated by FE-Simulation. The mechanical characterization shows the weakest link concerning the reliability of the different via geometries. The via with the cone-shaped bottom seems to have the best reliability with respect to mechanical stress.
AB - The influence of the via bottom geometry on stress development in Cu interconnects is investigated by FE-Simulation. The mechanical characterization shows the weakest link concerning the reliability of the different via geometries. The via with the cone-shaped bottom seems to have the best reliability with respect to mechanical stress.
UR - http://www.scopus.com/inward/record.url?scp=77956422312&partnerID=8YFLogxK
U2 - 10.1109/IPFA.2010.5532227
DO - 10.1109/IPFA.2010.5532227
M3 - Conference contribution
AN - SCOPUS:77956422312
SN - 9781424455973
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
BT - IPFA 2010 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits
T2 - 17th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2010
Y2 - 5 July 2010 through 9 July 2010
ER -