Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009 |
| Seiten | 1280-1284 |
| Seitenumfang | 5 |
| ISBN (elektronisch) | 9781424429509 |
| Publikationsstatus | Veröffentlicht - 2009 |
| Veranstaltung | 34th IEEE Photovoltaic Specialists Conference (PVSC 2009) - Philadelphia, PA, USA / Vereinigte Staaten Dauer: 7 Juni 2009 → 12 Juni 2009 Konferenznummer: 34 |
Publikationsreihe
| Name | Conference Record of the IEEE Photovoltaic Specialists Conference |
|---|---|
| ISSN (Print) | 0160-8371 |
Abstract
Solar modules are commercially fabricated for more than 30 years but there is little knowledge about its thermomechanical properties. Solid materials shrink or expand when subjected to temperature changes. The coefficients of thermal expansion (CTE) for silicon and glass are small compared to the CTE of the polymer sheets. This CTE-mismatch leads to mechanical stress and strain which can be critical for the solar cells, the interconnects and the polymers. We demonstrate that the digital image correlation technique (DIC) is capable of measuring displacements in modules that are within a climate chamber by an optical measurement through a transparent back sheet and one layer of encapsulation material. As a first demonstration the change of the gaps between adjacent cells is determined at various temperatures for three test laminates with three different interconnection techniques. We find the gap between two solar cells to deform about 0.4 - 0.6 μm/° C in the temperature range of 0°C to 80°C and slightly less in the temperature region below 0°C. The results are verified by a simplified calculation of the gap deformation.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Steuerungs- und Systemtechnik
- Ingenieurwesen (insg.)
- Wirtschaftsingenieurwesen und Fertigungstechnik
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
Ziele für nachhaltige Entwicklung
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009. 2009. S. 1280-1284 5411248 (Conference Record of the IEEE Photovoltaic Specialists Conference).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Measuring thermomechanical displacements of solar cells in laminates using digital image correlation
AU - Eitner, Ulrich
AU - Köntges, Marc
AU - Brendel, Rolf
N1 - Conference code: 34
PY - 2009
Y1 - 2009
N2 - Solar modules are commercially fabricated for more than 30 years but there is little knowledge about its thermomechanical properties. Solid materials shrink or expand when subjected to temperature changes. The coefficients of thermal expansion (CTE) for silicon and glass are small compared to the CTE of the polymer sheets. This CTE-mismatch leads to mechanical stress and strain which can be critical for the solar cells, the interconnects and the polymers. We demonstrate that the digital image correlation technique (DIC) is capable of measuring displacements in modules that are within a climate chamber by an optical measurement through a transparent back sheet and one layer of encapsulation material. As a first demonstration the change of the gaps between adjacent cells is determined at various temperatures for three test laminates with three different interconnection techniques. We find the gap between two solar cells to deform about 0.4 - 0.6 μm/° C in the temperature range of 0°C to 80°C and slightly less in the temperature region below 0°C. The results are verified by a simplified calculation of the gap deformation.
AB - Solar modules are commercially fabricated for more than 30 years but there is little knowledge about its thermomechanical properties. Solid materials shrink or expand when subjected to temperature changes. The coefficients of thermal expansion (CTE) for silicon and glass are small compared to the CTE of the polymer sheets. This CTE-mismatch leads to mechanical stress and strain which can be critical for the solar cells, the interconnects and the polymers. We demonstrate that the digital image correlation technique (DIC) is capable of measuring displacements in modules that are within a climate chamber by an optical measurement through a transparent back sheet and one layer of encapsulation material. As a first demonstration the change of the gaps between adjacent cells is determined at various temperatures for three test laminates with three different interconnection techniques. We find the gap between two solar cells to deform about 0.4 - 0.6 μm/° C in the temperature range of 0°C to 80°C and slightly less in the temperature region below 0°C. The results are verified by a simplified calculation of the gap deformation.
UR - http://www.scopus.com/inward/record.url?scp=77951578573&partnerID=8YFLogxK
U2 - 10.1109/PVSC.2009.5411248
DO - 10.1109/PVSC.2009.5411248
M3 - Conference contribution
AN - SCOPUS:77951578573
SN - 978-1-4244-2949-3
T3 - Conference Record of the IEEE Photovoltaic Specialists Conference
SP - 1280
EP - 1284
BT - 2009 34th IEEE Photovoltaic Specialists Conference, PVSC 2009
T2 - 34th IEEE Photovoltaic Specialists Conference (PVSC 2009)
Y2 - 7 June 2009 through 12 June 2009
ER -