Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | IEEE Sensors 2023 Conference Proceedings |
| ISBN (elektronisch) | 979-8-3503-0387-2 |
| Publikationsstatus | Veröffentlicht - 2023 |
Publikationsreihe
| Name | Proceedings of IEEE Sensors |
|---|---|
| ISSN (Print) | 1930-0395 |
| ISSN (elektronisch) | 2168-9229 |
Abstract
The process of silver sintering is a key technology in the fabrication of advanced electronic devices. In this study, a multilayer thin film sensor is built and integrated into the joining process of ultrasonic assisted silver sintering to measure the influence of ultrasound on the sintering temperature. The sensor is designed as a resistance thermometer with platinum as the sensing layer. The results show almost a linear relationship between the applied ultrasonic power and the measured temperature increase with a maximum of 4.5 °C at a power level of 7000 mW. In addition, higher normal forces result in greater temperature increase.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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IEEE Sensors 2023 Conference Proceedings. 2023. (Proceedings of IEEE Sensors).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Measurement of the Ultrasound Induced Temperature Change in an Ultrasonic Assisted Silver Sintering Process
AU - Hadeler, Steffen
AU - Long, Yangyang
AU - Twiefel, Jens
AU - Wurz, Marc Christopher
N1 - Funding Information: This work was funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) (Project ID 456662835) at the Institute for Micro Production Technology and the Institute of Dynamics and Vibration Research.
PY - 2023
Y1 - 2023
N2 - The process of silver sintering is a key technology in the fabrication of advanced electronic devices. In this study, a multilayer thin film sensor is built and integrated into the joining process of ultrasonic assisted silver sintering to measure the influence of ultrasound on the sintering temperature. The sensor is designed as a resistance thermometer with platinum as the sensing layer. The results show almost a linear relationship between the applied ultrasonic power and the measured temperature increase with a maximum of 4.5 °C at a power level of 7000 mW. In addition, higher normal forces result in greater temperature increase.
AB - The process of silver sintering is a key technology in the fabrication of advanced electronic devices. In this study, a multilayer thin film sensor is built and integrated into the joining process of ultrasonic assisted silver sintering to measure the influence of ultrasound on the sintering temperature. The sensor is designed as a resistance thermometer with platinum as the sensing layer. The results show almost a linear relationship between the applied ultrasonic power and the measured temperature increase with a maximum of 4.5 °C at a power level of 7000 mW. In addition, higher normal forces result in greater temperature increase.
KW - platinum
KW - silver sintering
KW - temperature thin film sensor
KW - ultrasound
UR - http://www.scopus.com/inward/record.url?scp=85179757375&partnerID=8YFLogxK
U2 - 10.1109/SENSORS56945.2023.10325249
DO - 10.1109/SENSORS56945.2023.10325249
M3 - Conference contribution
SN - 979-8-3503-0388-9
T3 - Proceedings of IEEE Sensors
BT - IEEE Sensors 2023 Conference Proceedings
ER -