Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2021 14th International Congress |
| Untertitel | Molded Interconnect Devices (MID) - scientific proceedings |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (elektronisch) | 9781728175096 |
| ISBN (Print) | 978-1-7281-7510-2 |
| Publikationsstatus | Veröffentlicht - 2021 |
| Veranstaltung | 14th International Congress Molded Interconnect Devices (MID 2021) - online, Virtual, Nurnberg, Deutschland Dauer: 8 Feb. 2021 → 11 Feb. 2021 Konferenznummer: 14 |
Abstract
In order to meet the increasing demand for data transmission over short distances of up to 100 m, the Optical Assembly and Connection Technology for ComponentIntegrated Bus Systems (OPTAVER) research group, funded by the German Research Foundation (DFG), developed a process for the additive manufacturing of three-dimensional optical waveguides. The research group focuses on design and modeling, simulation, and manufacturing polymer optical waveguides to produce 3D-Opto-Mechatronic-Integrated Devices (3D-Opto-MID). Inside 3D-Opto-MID, an optical coupler is presented based on an asymmetrical coupling principle. This paper reviews the entire process chain and the corresponding research results of the OPTAVER process.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Wirtschaftsingenieurwesen und Fertigungstechnik
- Ingenieurwesen (insg.)
- Werkstoffmechanik
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2021 14th International Congress: Molded Interconnect Devices (MID) - scientific proceedings. Institute of Electrical and Electronics Engineers Inc., 2021. 9361620.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Manufacturing of Polymer Optical Waveguides for 3D-Opto-MID
T2 - 14th International Congress Molded Interconnect Devices, MID 2021
AU - Hamjah, Mohd Khairulamzari
AU - Zeitler, Jochen
AU - Eiche, Yannic
AU - Lorenz, Lukas
AU - Backhaus, Carsten
AU - Hoffmann, Gerd Albert
AU - Wienke, Alexander
AU - Kaierle, Stefan
AU - Overmeyer, Ludger
AU - Lindlein, Norbert
AU - Bock, Karlheinz
AU - Franke, Joerg
N1 - Conference code: 14
PY - 2021
Y1 - 2021
N2 - In order to meet the increasing demand for data transmission over short distances of up to 100 m, the Optical Assembly and Connection Technology for ComponentIntegrated Bus Systems (OPTAVER) research group, funded by the German Research Foundation (DFG), developed a process for the additive manufacturing of three-dimensional optical waveguides. The research group focuses on design and modeling, simulation, and manufacturing polymer optical waveguides to produce 3D-Opto-Mechatronic-Integrated Devices (3D-Opto-MID). Inside 3D-Opto-MID, an optical coupler is presented based on an asymmetrical coupling principle. This paper reviews the entire process chain and the corresponding research results of the OPTAVER process.
AB - In order to meet the increasing demand for data transmission over short distances of up to 100 m, the Optical Assembly and Connection Technology for ComponentIntegrated Bus Systems (OPTAVER) research group, funded by the German Research Foundation (DFG), developed a process for the additive manufacturing of three-dimensional optical waveguides. The research group focuses on design and modeling, simulation, and manufacturing polymer optical waveguides to produce 3D-Opto-Mechatronic-Integrated Devices (3D-Opto-MID). Inside 3D-Opto-MID, an optical coupler is presented based on an asymmetrical coupling principle. This paper reviews the entire process chain and the corresponding research results of the OPTAVER process.
KW - 3D-Opto-MID
KW - aerosol jet printing
KW - asymmetrical optical bus coupling
KW - flexographic printing
KW - functionalization
KW - printed multimode waveguides
KW - Raytracing
KW - wave propagation method
UR - http://www.scopus.com/inward/record.url?scp=85102509757&partnerID=8YFLogxK
U2 - 10.1109/MID50463.2021.9361620
DO - 10.1109/MID50463.2021.9361620
M3 - Conference contribution
AN - SCOPUS:85102509757
SN - 978-1-7281-7510-2
BT - 2021 14th International Congress
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 8 February 2021 through 11 February 2021
ER -