Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
| Herausgeber (Verlag) | VDE Verlag GmbH |
| Seiten | 462-465 |
| Seitenumfang | 4 |
| ISBN (elektronisch) | 9783800762040 |
| Publikationsstatus | Veröffentlicht - 2023 |
| Veranstaltung | MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat MicroSystems - Dresden, Deutschland Dauer: 23 Okt. 2023 → 25 Okt. 2023 |
Abstract
Ultrasonic (US) wire bonding is a very complex process. Different mechanisms occur at different locations of the bonding interface in a very short time making a spatially resolved investigation of the process extremely difficult. As a result the local mechanisms stay unclear. Therefore, a novel 3×4 force sensor array has been developed for the in-situ investigations of the ultrasonic wire bonding process. The array is based on the piezoelectric ceramic lead zirconate titanate (PZT), which is first divided into individual sensor columns via precision dicing and then filled with a polymer. Each of these columns acts as a single sensor of the array with a sensing area of 360×160 μm2. The array was used to measure the local tangential forces, which occur at the contact region between the wire and the substrate during the bonding process. To be able to detect the local effects even more precisely a sensor array with smaller elements has been developed recently. Building on the existing design, the new version of the array now features 4×12 sensors with a sensing area of 100×100 μm2 while maintaining the same total size of around 1600×500 µm2 as before. This work presents the manufacturing and characterization of the new sensor array, which promises in-situ measurements of the bonding process with enhanced resolution.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
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MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. S. 462-465.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Manufacturing and Characterization of Piezoelectric Force Sensor Arrays for Investigation of Ultrasonic Wire Bonding
AU - Arndt, Matthias
AU - Long, Yangyang
AU - Hu, Chengyan
AU - Dencker, Folke
AU - Twiefel, Jens
AU - Wurz, Marc Christopher
N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2023
Y1 - 2023
N2 - Ultrasonic (US) wire bonding is a very complex process. Different mechanisms occur at different locations of the bonding interface in a very short time making a spatially resolved investigation of the process extremely difficult. As a result the local mechanisms stay unclear. Therefore, a novel 3×4 force sensor array has been developed for the in-situ investigations of the ultrasonic wire bonding process. The array is based on the piezoelectric ceramic lead zirconate titanate (PZT), which is first divided into individual sensor columns via precision dicing and then filled with a polymer. Each of these columns acts as a single sensor of the array with a sensing area of 360×160 μm2. The array was used to measure the local tangential forces, which occur at the contact region between the wire and the substrate during the bonding process. To be able to detect the local effects even more precisely a sensor array with smaller elements has been developed recently. Building on the existing design, the new version of the array now features 4×12 sensors with a sensing area of 100×100 μm2 while maintaining the same total size of around 1600×500 µm2 as before. This work presents the manufacturing and characterization of the new sensor array, which promises in-situ measurements of the bonding process with enhanced resolution.
AB - Ultrasonic (US) wire bonding is a very complex process. Different mechanisms occur at different locations of the bonding interface in a very short time making a spatially resolved investigation of the process extremely difficult. As a result the local mechanisms stay unclear. Therefore, a novel 3×4 force sensor array has been developed for the in-situ investigations of the ultrasonic wire bonding process. The array is based on the piezoelectric ceramic lead zirconate titanate (PZT), which is first divided into individual sensor columns via precision dicing and then filled with a polymer. Each of these columns acts as a single sensor of the array with a sensing area of 360×160 μm2. The array was used to measure the local tangential forces, which occur at the contact region between the wire and the substrate during the bonding process. To be able to detect the local effects even more precisely a sensor array with smaller elements has been developed recently. Building on the existing design, the new version of the array now features 4×12 sensors with a sensing area of 100×100 μm2 while maintaining the same total size of around 1600×500 µm2 as before. This work presents the manufacturing and characterization of the new sensor array, which promises in-situ measurements of the bonding process with enhanced resolution.
UR - http://www.scopus.com/inward/record.url?scp=85196917657&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85196917657
SP - 462
EP - 465
BT - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
PB - VDE Verlag GmbH
T2 - Technology Congress 2023
Y2 - 23 October 2023 through 25 October 2023
ER -