Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
| Herausgeber (Verlag) | VDE Verlag GmbH |
| Seiten | 672-675 |
| Seitenumfang | 4 |
| ISBN (elektronisch) | 9783800762040 |
| Publikationsstatus | Veröffentlicht - 2023 |
| Veranstaltung | MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat MicroSystems - Dresden, Deutschland Dauer: 23 Okt. 2023 → 25 Okt. 2023 |
Abstract
High operating temperatures are omnipresent in the production engineering environment. In order to achieve optimum production results, measurements of the temperature are carried out in most production processes. In this research, an integration concept, a temperature field simulation for positioning and a process chain for the production of a sensor insert in the forming zone of an extrusion die was developed. Subsequently, the application behavior and the applicability in the process were evaluated. It was shown that the insert could withstand the forces during extrusion and had no effect on the end product. In addition, a friction-induced temperature increases of 110 °C was observed during the extrusion process. There is a good agreement between the simulative prediction and the experimental results.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
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- BibTex
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MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. S. 672-675.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Manufacture and application of a sensor inlet for high-temperature measurements in the frictional zone of an extrusion die
AU - Raumel, Selina
AU - Moradi, Amirreza
AU - Wurz, Marc C.
N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2023
Y1 - 2023
N2 - High operating temperatures are omnipresent in the production engineering environment. In order to achieve optimum production results, measurements of the temperature are carried out in most production processes. In this research, an integration concept, a temperature field simulation for positioning and a process chain for the production of a sensor insert in the forming zone of an extrusion die was developed. Subsequently, the application behavior and the applicability in the process were evaluated. It was shown that the insert could withstand the forces during extrusion and had no effect on the end product. In addition, a friction-induced temperature increases of 110 °C was observed during the extrusion process. There is a good agreement between the simulative prediction and the experimental results.
AB - High operating temperatures are omnipresent in the production engineering environment. In order to achieve optimum production results, measurements of the temperature are carried out in most production processes. In this research, an integration concept, a temperature field simulation for positioning and a process chain for the production of a sensor insert in the forming zone of an extrusion die was developed. Subsequently, the application behavior and the applicability in the process were evaluated. It was shown that the insert could withstand the forces during extrusion and had no effect on the end product. In addition, a friction-induced temperature increases of 110 °C was observed during the extrusion process. There is a good agreement between the simulative prediction and the experimental results.
UR - http://www.scopus.com/inward/record.url?scp=85196915523&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85196915523
SP - 672
EP - 675
BT - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
PB - VDE Verlag GmbH
T2 - Technology Congress 2023
Y2 - 23 October 2023 through 25 October 2023
ER -