Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2016 12th International Congress Molded Interconnect Devices |
| Untertitel | Scientific Proceedings, MID 2016 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (elektronisch) | 9781509054282 |
| Publikationsstatus | Veröffentlicht - 8 Nov. 2016 |
| Veranstaltung | 12th International Congress on Molded Interconnect Devices, MID 2016 - Wurzburg, Deutschland Dauer: 28 Sept. 2016 → 29 Sept. 2016 |
Publikationsreihe
| Name | 2016 12th International Congress Molded Interconnect Devices - Scientific Proceedings, MID 2016 |
|---|
Abstract
This contribution is focused on Laser Direct Structuring (LDS) fabrication for upcoming generations of RFapplications covering millimeter-wave frequencies. Starting with a short motivation the current situation of LDS fabricated RF devices is presented. Subsequently, the requirements on the manufacturing process for future applications are defined. The main LDS manufacturing parameters and their influences on the RF properties are discussed. Especially the influence of the surface roughness of the applied metalization is considered and evaluated. On the example of a millimeter wave dielectric antenna operating at 24 GHz and 77 GHz the suitability of LDS fabrication is verified. An RF characterization of the test antennas is done and the results are discussed. On basis of this, possible applications, in the automotive as well as consumer sector, are pointed out. Summarizing the main findings of this contribution the next steps to be taken for a fabrication of future LDS MID RF devices are derived.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Wirtschaftsingenieurwesen und Fertigungstechnik
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Werkstoffwissenschaften (insg.)
- Polymere und Kunststoffe
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
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- BibTex
- RIS
2016 12th International Congress Molded Interconnect Devices : Scientific Proceedings, MID 2016. Institute of Electrical and Electronics Engineers Inc., 2016. 7738939 (2016 12th International Congress Molded Interconnect Devices - Scientific Proceedings, MID 2016).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - LDS manufacturing technology for next generation radio frequency applications
AU - Friedrich, Aline
AU - Geck, Bernd
AU - Fengler, Malte
PY - 2016/11/8
Y1 - 2016/11/8
N2 - This contribution is focused on Laser Direct Structuring (LDS) fabrication for upcoming generations of RFapplications covering millimeter-wave frequencies. Starting with a short motivation the current situation of LDS fabricated RF devices is presented. Subsequently, the requirements on the manufacturing process for future applications are defined. The main LDS manufacturing parameters and their influences on the RF properties are discussed. Especially the influence of the surface roughness of the applied metalization is considered and evaluated. On the example of a millimeter wave dielectric antenna operating at 24 GHz and 77 GHz the suitability of LDS fabrication is verified. An RF characterization of the test antennas is done and the results are discussed. On basis of this, possible applications, in the automotive as well as consumer sector, are pointed out. Summarizing the main findings of this contribution the next steps to be taken for a fabrication of future LDS MID RF devices are derived.
AB - This contribution is focused on Laser Direct Structuring (LDS) fabrication for upcoming generations of RFapplications covering millimeter-wave frequencies. Starting with a short motivation the current situation of LDS fabricated RF devices is presented. Subsequently, the requirements on the manufacturing process for future applications are defined. The main LDS manufacturing parameters and their influences on the RF properties are discussed. Especially the influence of the surface roughness of the applied metalization is considered and evaluated. On the example of a millimeter wave dielectric antenna operating at 24 GHz and 77 GHz the suitability of LDS fabrication is verified. An RF characterization of the test antennas is done and the results are discussed. On basis of this, possible applications, in the automotive as well as consumer sector, are pointed out. Summarizing the main findings of this contribution the next steps to be taken for a fabrication of future LDS MID RF devices are derived.
KW - dielectric horn antenna
KW - laser direct structuring
KW - millimeter wave
KW - molded interconnect devices
UR - http://www.scopus.com/inward/record.url?scp=85006867390&partnerID=8YFLogxK
U2 - 10.1109/ICMID.2016.7738939
DO - 10.1109/ICMID.2016.7738939
M3 - Conference contribution
AN - SCOPUS:85006867390
T3 - 2016 12th International Congress Molded Interconnect Devices - Scientific Proceedings, MID 2016
BT - 2016 12th International Congress Molded Interconnect Devices
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th International Congress on Molded Interconnect Devices, MID 2016
Y2 - 28 September 2016 through 29 September 2016
ER -