Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 983-990 |
| Seitenumfang | 8 |
| Fachzeitschrift | Physics Procedia |
| Jahrgang | 56 |
| Ausgabenummer | C |
| Publikationsstatus | Veröffentlicht - 9 Sept. 2014 |
| Extern publiziert | Ja |
| Veranstaltung | International Conference on Laser Assisted Net Shape Engineering, LANE 2014 - Fürth, Deutschland Dauer: 8 Sept. 2014 → 11 Sept. 2014 |
Abstract
High temperature applications of printed circuit boards (PCB) require materials with specifically adapted properties. Hence, conventional electrically isolating glass fiber and epoxy-resin materials have to be replaced by thin borosilicate glass. Therefore, an industrially suitable process to remove the metal coatings from the brittle thin glass has to be developed. Laser processing has the advantage of individualization for the production of customer-specific PCBs. Thus, laser ablation of metal coatings for electrical isolation is investigated with different material composites based on thin glass. The study aims to identify a laser process for a picosecond laser source with 515 nm wavelength to perform the process without damaging the glass substrate with a high throughput.
ASJC Scopus Sachgebiete
- Physik und Astronomie (insg.)
- Allgemeine Physik und Astronomie
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in: Physics Procedia, Jahrgang 56, Nr. C, 09.09.2014, S. 983-990.
Publikation: Beitrag in Fachzeitschrift › Konferenzaufsatz in Fachzeitschrift › Forschung › Peer-Review
}
TY - JOUR
T1 - Laser processing of thin glass printed circuit boards with a picosecond laser at 515 nm wavelength
AU - Plat, Kristin
AU - von Witzendorff, Philipp
AU - Suttmann, Oliver
AU - Overmeyer, Ludger
N1 - Funding information: The project “Glass PCB – Development of a Multilayer Circuit Board Based on Thin Glass” has been funded by the Central Innovation Program SME (ZIM) of the Federal Ministry of Economics and Technology (BMWi).
PY - 2014/9/9
Y1 - 2014/9/9
N2 - High temperature applications of printed circuit boards (PCB) require materials with specifically adapted properties. Hence, conventional electrically isolating glass fiber and epoxy-resin materials have to be replaced by thin borosilicate glass. Therefore, an industrially suitable process to remove the metal coatings from the brittle thin glass has to be developed. Laser processing has the advantage of individualization for the production of customer-specific PCBs. Thus, laser ablation of metal coatings for electrical isolation is investigated with different material composites based on thin glass. The study aims to identify a laser process for a picosecond laser source with 515 nm wavelength to perform the process without damaging the glass substrate with a high throughput.
AB - High temperature applications of printed circuit boards (PCB) require materials with specifically adapted properties. Hence, conventional electrically isolating glass fiber and epoxy-resin materials have to be replaced by thin borosilicate glass. Therefore, an industrially suitable process to remove the metal coatings from the brittle thin glass has to be developed. Laser processing has the advantage of individualization for the production of customer-specific PCBs. Thus, laser ablation of metal coatings for electrical isolation is investigated with different material composites based on thin glass. The study aims to identify a laser process for a picosecond laser source with 515 nm wavelength to perform the process without damaging the glass substrate with a high throughput.
KW - Ablation
KW - Thin glass printed circuit board
UR - http://www.scopus.com/inward/record.url?scp=84923187904&partnerID=8YFLogxK
U2 - 10.1016/j.phpro.2014.08.009
DO - 10.1016/j.phpro.2014.08.009
M3 - Conference article
AN - SCOPUS:84923187904
VL - 56
SP - 983
EP - 990
JO - Physics Procedia
JF - Physics Procedia
SN - 1875-3884
IS - C
T2 - International Conference on Laser Assisted Net Shape Engineering, LANE 2014
Y2 - 8 September 2014 through 11 September 2014
ER -