Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 484-488 |
| Seitenumfang | 5 |
| Fachzeitschrift | Procedia CIRP |
| Jahrgang | 124 |
| Frühes Online-Datum | 11 Sept. 2024 |
| Publikationsstatus | Veröffentlicht - 2024 |
| Veranstaltung | 13th CIRP Conference on Photonic Technologies, LANE 2024 - Fürth, Deutschland Dauer: 15 Sept. 2024 → 19 Sept. 2024 |
Abstract
The use of glass, particularly fused silica (FS), instead of polymers or semiconductors as optical waveguide material is advantageous due to broadband transmission, reduced propagation losses, and enhanced thermal and mechanical stability. In this contribution, laser glass deposition for the chip-scale fabrication of FS-based optical waveguides is investigated. We use a CO2 laser with emission at a wavelength of 10.6 μm to weld conventional single-mode glass fibers onto a FS substrate, with the aim of maintaining the waveguide properties of the fibers. Synchronized translational and rotational axis movements allow for positioning of the waveguides in arbitrary geometries. Furthermore, a CO2 laser-based cleaving method is introduced, which facilitates on-chip creation of waveguide end facets for optical coupling. An analysis of the cleave geometry in dependence on process parameters as well as optical coupling losses are presented. Coupling losses of 0.88 dB for a laser-cleave and propagation losses of 0.56 dB/cm for a 10 cm on-chip welded fiber were achieved. The results pave the way for on-chip integration of fiber-based systems like lasers, sensing devices or optical communication networks.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Steuerungs- und Systemtechnik
- Ingenieurwesen (insg.)
- Wirtschaftsingenieurwesen und Fertigungstechnik
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in: Procedia CIRP, Jahrgang 124, 2024, S. 484-488.
Publikation: Beitrag in Fachzeitschrift › Konferenzaufsatz in Fachzeitschrift › Forschung › Peer-Review
}
TY - JOUR
T1 - Laser Glass deposition of single-mode glass fibers for the fabrication of chip-scale photonic circuits
AU - Spengler, Florian
AU - Olaf Waldhauer, Sven
AU - Hinkelmann, Moritz
AU - Neumann, Jörg
AU - Kaierle, Stefan
AU - Kracht, Dietmar
N1 - Publisher Copyright: © 2024 The Authors.
PY - 2024
Y1 - 2024
N2 - The use of glass, particularly fused silica (FS), instead of polymers or semiconductors as optical waveguide material is advantageous due to broadband transmission, reduced propagation losses, and enhanced thermal and mechanical stability. In this contribution, laser glass deposition for the chip-scale fabrication of FS-based optical waveguides is investigated. We use a CO2 laser with emission at a wavelength of 10.6 μm to weld conventional single-mode glass fibers onto a FS substrate, with the aim of maintaining the waveguide properties of the fibers. Synchronized translational and rotational axis movements allow for positioning of the waveguides in arbitrary geometries. Furthermore, a CO2 laser-based cleaving method is introduced, which facilitates on-chip creation of waveguide end facets for optical coupling. An analysis of the cleave geometry in dependence on process parameters as well as optical coupling losses are presented. Coupling losses of 0.88 dB for a laser-cleave and propagation losses of 0.56 dB/cm for a 10 cm on-chip welded fiber were achieved. The results pave the way for on-chip integration of fiber-based systems like lasers, sensing devices or optical communication networks.
AB - The use of glass, particularly fused silica (FS), instead of polymers or semiconductors as optical waveguide material is advantageous due to broadband transmission, reduced propagation losses, and enhanced thermal and mechanical stability. In this contribution, laser glass deposition for the chip-scale fabrication of FS-based optical waveguides is investigated. We use a CO2 laser with emission at a wavelength of 10.6 μm to weld conventional single-mode glass fibers onto a FS substrate, with the aim of maintaining the waveguide properties of the fibers. Synchronized translational and rotational axis movements allow for positioning of the waveguides in arbitrary geometries. Furthermore, a CO2 laser-based cleaving method is introduced, which facilitates on-chip creation of waveguide end facets for optical coupling. An analysis of the cleave geometry in dependence on process parameters as well as optical coupling losses are presented. Coupling losses of 0.88 dB for a laser-cleave and propagation losses of 0.56 dB/cm for a 10 cm on-chip welded fiber were achieved. The results pave the way for on-chip integration of fiber-based systems like lasers, sensing devices or optical communication networks.
KW - COLaser Welding
KW - Laser Glass Deposition
KW - Laser-Based Cleaving
KW - On-Chip Waveguides
KW - Photonic Integrated Circuits
UR - http://www.scopus.com/inward/record.url?scp=85204340096&partnerID=8YFLogxK
U2 - 10.1016/j.procir.2024.08.158
DO - 10.1016/j.procir.2024.08.158
M3 - Conference article
AN - SCOPUS:85204340096
VL - 124
SP - 484
EP - 488
JO - Procedia CIRP
JF - Procedia CIRP
SN - 2212-8271
T2 - 13th CIRP Conference on Photonic Technologies, LANE 2024
Y2 - 15 September 2024 through 19 September 2024
ER -