Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI |
| Herausgeber (Verlag) | SPIE |
| ISBN (elektronisch) | 9781628419702 |
| Publikationsstatus | Veröffentlicht - 14 März 2016 |
| Extern publiziert | Ja |
| Veranstaltung | Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI - San Francisco, USA / Vereinigte Staaten Dauer: 15 Feb. 2016 → 18 Feb. 2016 |
Publikationsreihe
| Name | Proceedings of SPIE - The International Society for Optical Engineering |
|---|---|
| Band | 9735 |
| ISSN (Print) | 0277-786X |
| ISSN (elektronisch) | 1996-756X |
Abstract
The application of thin borosilicate glass as interposer material requires methods for separation and drilling of this material. Laser processing with short and ultra-short laser pulses have proven to enable high quality cuts by either direct ablation or internal glass modification and cleavage. A recently developed high power UV nanosecond laser source allows for pulse shaping of individual laser pulses. Thus, the pulse duration, pulse bursts and the repetition rate can be set individually at a maximum output power of up to 60 W. This opens a completely new process window, which could not be entered with conventional Q-switched pulsed laser sources. In this study, the novel pulsed UV laser system was used to study the laser ablation process on 400 μm thin borosilicate glass at different pulse durations ranging from 2 - 10 ns and a pulse burst with two 10 ns laser pulses with a separation of 10 ns. Single line scan experiments were performed to correlate the process parameters and the laser pulse shape with the ablation depth and cutting edge chipping. Increasing the pulse duration within the single pulse experiments from 2 ns to longer pulse durations led to a moderate increase in ablation depth and a significant increase in chipping. The highest material removal was achieved with the 2x10 ns pulse burst. Experimental data also suggest that chipping could be reduced, while maintaining a high ablation depth by selecting an adequate pulse overlap. We also demonstrate that real-time combination of different pulse patterns during drilling a thin borosilicate glass produced holes with low overall chipping at a high throughput rate.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Informatik (insg.)
- Angewandte Informatik
- Mathematik (insg.)
- Angewandte Mathematik
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI. SPIE, 2016. 97350J (Proceedings of SPIE - The International Society for Optical Engineering; Band 9735).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Laser ablation of borosilicate glass with high power shaped UV nanosecond laser pulses
AU - von Witzendorff, Philipp
AU - Bordin, Andrea
AU - Suttmann, Oliver
AU - Patel, Rajesh S.
AU - Bovatsek, James
AU - Overmeyer, Ludger
PY - 2016/3/14
Y1 - 2016/3/14
N2 - The application of thin borosilicate glass as interposer material requires methods for separation and drilling of this material. Laser processing with short and ultra-short laser pulses have proven to enable high quality cuts by either direct ablation or internal glass modification and cleavage. A recently developed high power UV nanosecond laser source allows for pulse shaping of individual laser pulses. Thus, the pulse duration, pulse bursts and the repetition rate can be set individually at a maximum output power of up to 60 W. This opens a completely new process window, which could not be entered with conventional Q-switched pulsed laser sources. In this study, the novel pulsed UV laser system was used to study the laser ablation process on 400 μm thin borosilicate glass at different pulse durations ranging from 2 - 10 ns and a pulse burst with two 10 ns laser pulses with a separation of 10 ns. Single line scan experiments were performed to correlate the process parameters and the laser pulse shape with the ablation depth and cutting edge chipping. Increasing the pulse duration within the single pulse experiments from 2 ns to longer pulse durations led to a moderate increase in ablation depth and a significant increase in chipping. The highest material removal was achieved with the 2x10 ns pulse burst. Experimental data also suggest that chipping could be reduced, while maintaining a high ablation depth by selecting an adequate pulse overlap. We also demonstrate that real-time combination of different pulse patterns during drilling a thin borosilicate glass produced holes with low overall chipping at a high throughput rate.
AB - The application of thin borosilicate glass as interposer material requires methods for separation and drilling of this material. Laser processing with short and ultra-short laser pulses have proven to enable high quality cuts by either direct ablation or internal glass modification and cleavage. A recently developed high power UV nanosecond laser source allows for pulse shaping of individual laser pulses. Thus, the pulse duration, pulse bursts and the repetition rate can be set individually at a maximum output power of up to 60 W. This opens a completely new process window, which could not be entered with conventional Q-switched pulsed laser sources. In this study, the novel pulsed UV laser system was used to study the laser ablation process on 400 μm thin borosilicate glass at different pulse durations ranging from 2 - 10 ns and a pulse burst with two 10 ns laser pulses with a separation of 10 ns. Single line scan experiments were performed to correlate the process parameters and the laser pulse shape with the ablation depth and cutting edge chipping. Increasing the pulse duration within the single pulse experiments from 2 ns to longer pulse durations led to a moderate increase in ablation depth and a significant increase in chipping. The highest material removal was achieved with the 2x10 ns pulse burst. Experimental data also suggest that chipping could be reduced, while maintaining a high ablation depth by selecting an adequate pulse overlap. We also demonstrate that real-time combination of different pulse patterns during drilling a thin borosilicate glass produced holes with low overall chipping at a high throughput rate.
KW - borosilicate glass
KW - glass processing
KW - Laser processing
KW - thin glass
KW - UV nanosecond laser
UR - http://www.scopus.com/inward/record.url?scp=84981288186&partnerID=8YFLogxK
U2 - 10.1117/12.2209313
DO - 10.1117/12.2209313
M3 - Conference contribution
AN - SCOPUS:84981288186
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI
PB - SPIE
T2 - Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXI
Y2 - 15 February 2016 through 18 February 2016
ER -