Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seiten | 405-410 |
| Seitenumfang | 6 |
| ISBN (elektronisch) | 9781509043682 |
| Publikationsstatus | Veröffentlicht - 21 Feb. 2017 |
| Veranstaltung | 18th IEEE Electronics Packaging Technology Conference, EPTC 2016 - Singapore, Singapur Dauer: 30 Nov. 2016 → 3 Dez. 2016 |
Abstract
As an inevitable step during ultrasonic bonding of aluminum or copper materials, the removal of oxides that prevent the bond formation is essential for obtaining high quality. Nevertheless, the oxides removal process is still unclear after tens of years' application of ultrasonic bonding. In this project, the removal mechanism was investigated via the analysis of an artificially coated oxide layer. The oxide removal process was observed in real-time by a high-speed observation system and the oxides distribution after the bonding process was observed under an electron microscope. The results show that during the bonding process, the detached oxides first agglomerate into larger particles and were then pressed outside of the contact area. The areas of the particles were counted and fit to a lognormal distribution.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Werkstoffwissenschaften (insg.)
- Keramische und Verbundwerkstoffe
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Werkstoffwissenschaften (insg.)
- Metalle und Legierungen
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Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., 2017. S. 405-410 7861512.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Investigations on the oxide removal mechanism during ultrasonic wedge-wedge bonding process
AU - Long, Yangyang
AU - Dencker, Folke
AU - Schneider, Friedrich
AU - Emde, Benjamin
AU - Li, Chun
AU - Hermsdorf, Jörg
AU - Wurz, Marc Christopher
AU - Twiefel, Jens
N1 - Publisher Copyright: © 2016 IEEE. Copyright: Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/2/21
Y1 - 2017/2/21
N2 - As an inevitable step during ultrasonic bonding of aluminum or copper materials, the removal of oxides that prevent the bond formation is essential for obtaining high quality. Nevertheless, the oxides removal process is still unclear after tens of years' application of ultrasonic bonding. In this project, the removal mechanism was investigated via the analysis of an artificially coated oxide layer. The oxide removal process was observed in real-time by a high-speed observation system and the oxides distribution after the bonding process was observed under an electron microscope. The results show that during the bonding process, the detached oxides first agglomerate into larger particles and were then pressed outside of the contact area. The areas of the particles were counted and fit to a lognormal distribution.
AB - As an inevitable step during ultrasonic bonding of aluminum or copper materials, the removal of oxides that prevent the bond formation is essential for obtaining high quality. Nevertheless, the oxides removal process is still unclear after tens of years' application of ultrasonic bonding. In this project, the removal mechanism was investigated via the analysis of an artificially coated oxide layer. The oxide removal process was observed in real-time by a high-speed observation system and the oxides distribution after the bonding process was observed under an electron microscope. The results show that during the bonding process, the detached oxides first agglomerate into larger particles and were then pressed outside of the contact area. The areas of the particles were counted and fit to a lognormal distribution.
UR - http://www.scopus.com/inward/record.url?scp=85016129751&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2016.7861512
DO - 10.1109/EPTC.2016.7861512
M3 - Conference contribution
AN - SCOPUS:85016129751
SP - 405
EP - 410
BT - Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th IEEE Electronics Packaging Technology Conference, EPTC 2016
Y2 - 30 November 2016 through 3 December 2016
ER -