Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seiten | 288-291 |
| Seitenumfang | 4 |
| ISBN (elektronisch) | 9781665416191 |
| ISBN (Print) | 978-1-6654-1620-7 |
| Publikationsstatus | Veröffentlicht - 2021 |
| Veranstaltung | 23rd IEEE Electronics Packaging Technology Conference, EPTC 2021 - Virtual, Online, Singapur Dauer: 1 Dez. 2021 → 30 Dez. 2021 |
Abstract
Silver sintering is a very important state-of-the-art joining process in the production of high-performance electronic components, as conventional assembly and connection technology is reaching its limits, especially due to the increasing requirements of e-mobility. Silver sintering is particularly suitable for today's high-performance electronic components such as IGBTs or diodes. However, the silver compound sintering process is not yet widely used. This is due to the very high process pressures, the high process temperatures, long process times and fluctuations in the strength of the joint. This work shows the potential and preliminary results on the optimization of silver compound sintering by using ultrasound in the joining zone and by adding low melting alloy partners to reduce the required sintering temperature. This generates a completely new process which is introduced by the authors as Ultrasonic Transient Liquid Phase Sintering (UTLPS). Without ultrasound, the shear strength of pure silver sintering joints increases as the temperature and process duration increase. When ultrasonic vibration is applied, for selected process parameters, the shear strength could be improved from 6 MPa to 12 MPa with the increasing of ultrasonic power. The addition of low-melting point alloy partners reduces the required sintering temperature. The combination of the addition of the alloying element indium and the application of ultrasonic vibration leads to an increase in shear strength with a maximum value of about 20 MPa.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Chemische Verfahrenstechnik (insg.)
- Fließ- und Transferprozesse von Flüssigkeiten
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2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers Inc., 2021. S. 288-291.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Investigations on Silver Sintering using an Ultrasonic Transient Liquid Phase Sintering Process
AU - Hadeler, Steffen
AU - Seefisch, Henning
AU - Ottermann, Rico
AU - Long, Yangyang
AU - Dencker, Folke
AU - Wurz, Marc Christopher
AU - Twiefel, Jens
N1 - Funding Information: This work was funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) (Project ID 456662835) at the Institute for Micro Production Technology and the Institute of Dynamics and Vibration Research.
PY - 2021
Y1 - 2021
N2 - Silver sintering is a very important state-of-the-art joining process in the production of high-performance electronic components, as conventional assembly and connection technology is reaching its limits, especially due to the increasing requirements of e-mobility. Silver sintering is particularly suitable for today's high-performance electronic components such as IGBTs or diodes. However, the silver compound sintering process is not yet widely used. This is due to the very high process pressures, the high process temperatures, long process times and fluctuations in the strength of the joint. This work shows the potential and preliminary results on the optimization of silver compound sintering by using ultrasound in the joining zone and by adding low melting alloy partners to reduce the required sintering temperature. This generates a completely new process which is introduced by the authors as Ultrasonic Transient Liquid Phase Sintering (UTLPS). Without ultrasound, the shear strength of pure silver sintering joints increases as the temperature and process duration increase. When ultrasonic vibration is applied, for selected process parameters, the shear strength could be improved from 6 MPa to 12 MPa with the increasing of ultrasonic power. The addition of low-melting point alloy partners reduces the required sintering temperature. The combination of the addition of the alloying element indium and the application of ultrasonic vibration leads to an increase in shear strength with a maximum value of about 20 MPa.
AB - Silver sintering is a very important state-of-the-art joining process in the production of high-performance electronic components, as conventional assembly and connection technology is reaching its limits, especially due to the increasing requirements of e-mobility. Silver sintering is particularly suitable for today's high-performance electronic components such as IGBTs or diodes. However, the silver compound sintering process is not yet widely used. This is due to the very high process pressures, the high process temperatures, long process times and fluctuations in the strength of the joint. This work shows the potential and preliminary results on the optimization of silver compound sintering by using ultrasound in the joining zone and by adding low melting alloy partners to reduce the required sintering temperature. This generates a completely new process which is introduced by the authors as Ultrasonic Transient Liquid Phase Sintering (UTLPS). Without ultrasound, the shear strength of pure silver sintering joints increases as the temperature and process duration increase. When ultrasonic vibration is applied, for selected process parameters, the shear strength could be improved from 6 MPa to 12 MPa with the increasing of ultrasonic power. The addition of low-melting point alloy partners reduces the required sintering temperature. The combination of the addition of the alloying element indium and the application of ultrasonic vibration leads to an increase in shear strength with a maximum value of about 20 MPa.
UR - http://www.scopus.com/inward/record.url?scp=85124800163&partnerID=8YFLogxK
U2 - 10.1109/eptc53413.2021.9663981
DO - 10.1109/eptc53413.2021.9663981
M3 - Conference contribution
AN - SCOPUS:85124800163
SN - 978-1-6654-1620-7
SP - 288
EP - 291
BT - 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd IEEE Electronics Packaging Technology Conference, EPTC 2021
Y2 - 1 December 2021 through 30 December 2021
ER -