Details
Originalsprache | Englisch |
---|---|
Titel des Sammelwerks | ECS Transactions - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting |
Seiten | 207-216 |
Seitenumfang | 10 |
Auflage | 45 |
Publikationsstatus | Veröffentlicht - 2009 |
Veranstaltung | Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting - Honolulu, HI, USA / Vereinigte Staaten Dauer: 12 Okt. 2008 → 17 Okt. 2008 |
Publikationsreihe
Name | ECS Transactions |
---|---|
Nummer | 45 |
Band | 16 |
ISSN (Print) | 1938-5862 |
ISSN (elektronisch) | 1938-6737 |
Abstract
To create a surface suitable for tribological applications, a layer of nanoparticles was deposited on a metal coated substrate, followed by embedding the nanoparticles in a metal matrix. For the deposition, TiO2 and SiO2 nanoparticles were used, followed by a Cu embedding by electroplating. TiO2 particles failed to deliver satisfying results due to agglomeration. The results coming closest to achieving a monolayer were obtained with SiO2 nanoparticles. For the deposition, the SiO 2 nanoparticles were attracted to the surface by utilizing zeta potential differences between the surface and the nanoparticles. To achieve an optimal zeta potential, the pH value of the deposition solution was adjusted appropriately. After their deposition, the SiO2 nanoparticles were attached to the surface by heat treatment. Afterwards, the SiO2 nanoparticles were embedded by electroplating. Best electroplating results were achieved on SiO2 nanoparticle layers with no continuous surface coverage, i.e. occasional voids between the nanoparticles.
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ECS Transactions - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting. 45. Aufl. 2009. S. 207-216 (ECS Transactions; Band 16, Nr. 45).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Investigations on embedding nanoparticles by electroplating
AU - Wurz, M.
AU - Oekermann, T.
AU - Wagner, P.
AU - Ruffert, C.
AU - Caro, J.
AU - Gatzen, H. H.
PY - 2009
Y1 - 2009
N2 - To create a surface suitable for tribological applications, a layer of nanoparticles was deposited on a metal coated substrate, followed by embedding the nanoparticles in a metal matrix. For the deposition, TiO2 and SiO2 nanoparticles were used, followed by a Cu embedding by electroplating. TiO2 particles failed to deliver satisfying results due to agglomeration. The results coming closest to achieving a monolayer were obtained with SiO2 nanoparticles. For the deposition, the SiO 2 nanoparticles were attracted to the surface by utilizing zeta potential differences between the surface and the nanoparticles. To achieve an optimal zeta potential, the pH value of the deposition solution was adjusted appropriately. After their deposition, the SiO2 nanoparticles were attached to the surface by heat treatment. Afterwards, the SiO2 nanoparticles were embedded by electroplating. Best electroplating results were achieved on SiO2 nanoparticle layers with no continuous surface coverage, i.e. occasional voids between the nanoparticles.
AB - To create a surface suitable for tribological applications, a layer of nanoparticles was deposited on a metal coated substrate, followed by embedding the nanoparticles in a metal matrix. For the deposition, TiO2 and SiO2 nanoparticles were used, followed by a Cu embedding by electroplating. TiO2 particles failed to deliver satisfying results due to agglomeration. The results coming closest to achieving a monolayer were obtained with SiO2 nanoparticles. For the deposition, the SiO 2 nanoparticles were attracted to the surface by utilizing zeta potential differences between the surface and the nanoparticles. To achieve an optimal zeta potential, the pH value of the deposition solution was adjusted appropriately. After their deposition, the SiO2 nanoparticles were attached to the surface by heat treatment. Afterwards, the SiO2 nanoparticles were embedded by electroplating. Best electroplating results were achieved on SiO2 nanoparticle layers with no continuous surface coverage, i.e. occasional voids between the nanoparticles.
UR - http://www.scopus.com/inward/record.url?scp=70449669648&partnerID=8YFLogxK
U2 - 10.1149/1.3140023
DO - 10.1149/1.3140023
M3 - Conference contribution
AN - SCOPUS:70449669648
SN - 9781615673162
T3 - ECS Transactions
SP - 207
EP - 216
BT - ECS Transactions - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting
T2 - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting
Y2 - 12 October 2008 through 17 October 2008
ER -