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Investigation of FPGA and SRAM Cells under Radiation Exposure

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

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  • Technische Universität Braunschweig
  • Wehrwissenschaftliches Institut Für Schutztechnologien - ABC-Schutz (WIS)
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OriginalspracheEnglisch
Titel des Sammelwerks2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
ISBN (elektronisch)9781665458368
ISBN (Print)978-1-6654-5837-5
PublikationsstatusVeröffentlicht - 2022
Veranstaltung23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 - St Julian, Malta
Dauer: 25 Apr. 202227 Apr. 2022

Publikationsreihe

Name2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Abstract

Basically, every human as well as electronical equipment on earth, is naturally exposed to ionizing radiation. This may lead to unwanted failures, especially in microelectronic devices. This becomes more severe due to the continuously downscaling of microelectronic structures. The use of SRAM-based FPGAs for aerospace applications is viewed critically [1]-[3]. Autonomous driving and the expectation of more than 8000 new launched satellites, for navigation and communication, in the next few years increases the need for radiation hardened (Rad-Hard) components, which are expensive. Therefore, the aim is to find commercials-of-The-shelf (COTS), which meets the need for this kind of harsh environment. Normally, Rad-Hard components are specially designed and tested especially for the application in automotive. It is well known that test time in all cases is expensive and time-consuming. Furthermore, simulations are more and more desired to decrease test times and allow a deeper look into the physical behavior of components and devices.

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Investigation of FPGA and SRAM Cells under Radiation Exposure. / Weide-Zaage, Kirsten; Paya-Vaya, Guillermo; Schmidt, Katharina et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Weide-Zaage, K, Paya-Vaya, G, Schmidt, K & Hagenah, D 2022, Investigation of FPGA and SRAM Cells under Radiation Exposure. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, Institute of Electrical and Electronics Engineers Inc., 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, St Julian, Malta, 25 Apr. 2022. https://doi.org/10.1109/EuroSimE54907.2022.9758864
Weide-Zaage, K., Paya-Vaya, G., Schmidt, K., & Hagenah, D. (2022). Investigation of FPGA and SRAM Cells under Radiation Exposure. In 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EuroSimE54907.2022.9758864
Weide-Zaage K, Paya-Vaya G, Schmidt K, Hagenah D. Investigation of FPGA and SRAM Cells under Radiation Exposure. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc. 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). doi: 10.1109/EuroSimE54907.2022.9758864
Weide-Zaage, Kirsten ; Paya-Vaya, Guillermo ; Schmidt, Katharina et al. / Investigation of FPGA and SRAM Cells under Radiation Exposure. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).
Download
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abstract = "Basically, every human as well as electronical equipment on earth, is naturally exposed to ionizing radiation. This may lead to unwanted failures, especially in microelectronic devices. This becomes more severe due to the continuously downscaling of microelectronic structures. The use of SRAM-based FPGAs for aerospace applications is viewed critically [1]-[3]. Autonomous driving and the expectation of more than 8000 new launched satellites, for navigation and communication, in the next few years increases the need for radiation hardened (Rad-Hard) components, which are expensive. Therefore, the aim is to find commercials-of-The-shelf (COTS), which meets the need for this kind of harsh environment. Normally, Rad-Hard components are specially designed and tested especially for the application in automotive. It is well known that test time in all cases is expensive and time-consuming. Furthermore, simulations are more and more desired to decrease test times and allow a deeper look into the physical behavior of components and devices.",
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Download

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AU - Paya-Vaya, Guillermo

AU - Schmidt, Katharina

AU - Hagenah, Dorian

N1 - Publisher Copyright: © 2022 IEEE.

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