Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015 |
| Herausgeber/-innen | R. Leach |
| Seiten | 245-246 |
| Seitenumfang | 2 |
| ISBN (elektronisch) | 9780956679079 |
| Publikationsstatus | Veröffentlicht - 1 Jan. 2015 |
| Veranstaltung | 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015 - Leuven, Belgien Dauer: 1 Juni 2015 → 5 Juni 2015 |
Publikationsreihe
| Name | Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015 |
|---|
Abstract
For an active compensation of workpiece clamping failures in lathes a novel fine positioning method using an active chuck is developed. The position of the workpiece is determined by two tactile displacement sensors. The chuck consists of integrated stepper motors which compensate eccentric displacement and tilting errors. The corrected position is fixed by frictional locking caused by the tensile force. All components required for this purpose are implemented in a lathe and examined in a turning process. The results proof a significant reduction of eccentric errors and the basic suitability of this method.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Allgemeine Materialwissenschaften
- Ingenieurwesen (insg.)
- Wirtschaftsingenieurwesen und Fertigungstechnik
- Ingenieurwesen (insg.)
- Maschinenbau
- Physik und Astronomie (insg.)
- Instrumentierung
- Umweltwissenschaften (insg.)
- Environmental engineering
Zitieren
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- BibTex
- RIS
Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015. Hrsg. / R. Leach. 2015. S. 245-246 (Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Investigation of a fine positioning method in lathes using an active clamping chuck
AU - Denkena, B.
AU - Hülsemeyer, L.
PY - 2015/1/1
Y1 - 2015/1/1
N2 - For an active compensation of workpiece clamping failures in lathes a novel fine positioning method using an active chuck is developed. The position of the workpiece is determined by two tactile displacement sensors. The chuck consists of integrated stepper motors which compensate eccentric displacement and tilting errors. The corrected position is fixed by frictional locking caused by the tensile force. All components required for this purpose are implemented in a lathe and examined in a turning process. The results proof a significant reduction of eccentric errors and the basic suitability of this method.
AB - For an active compensation of workpiece clamping failures in lathes a novel fine positioning method using an active chuck is developed. The position of the workpiece is determined by two tactile displacement sensors. The chuck consists of integrated stepper motors which compensate eccentric displacement and tilting errors. The corrected position is fixed by frictional locking caused by the tensile force. All components required for this purpose are implemented in a lathe and examined in a turning process. The results proof a significant reduction of eccentric errors and the basic suitability of this method.
KW - Clamping technology
KW - Fine positioning
KW - Lathe
UR - http://www.scopus.com/inward/record.url?scp=84936158051&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84936158051
T3 - Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015
SP - 245
EP - 246
BT - Proceedings of the 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015
A2 - Leach, R.
T2 - 15th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2015
Y2 - 1 June 2015 through 5 June 2015
ER -