Details
| Originalsprache | Englisch |
|---|---|
| Publikationsstatus | Veröffentlicht - 2016 |
| Veranstaltung | 16th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2016 - Nottingham, Großbritannien / Vereinigtes Königreich Dauer: 30 Mai 2016 → 3 Juni 2016 |
Konferenz
| Konferenz | 16th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2016 |
|---|---|
| Land/Gebiet | Großbritannien / Vereinigtes Königreich |
| Ort | Nottingham |
| Zeitraum | 30 Mai 2016 → 3 Juni 2016 |
Abstract
Dicing of hard and brittle materials is still the main choice for machining the same. There are additional manufacturing processes for handling ceramics like silicon carbide, alumina or silica. The mechanical machining of hard and brittle materials are mostly accompanied with induced cracks, chipping, tool wear, sub-surface damage, residual stress and influenced surface zones. These surface and sub-surface failures are adversely for later application of ceramics as a structural or functional part of MEMS. This paper shows a way to manufacture complex ceramic structures out of unsintered pyrophyllite without the negative effects of cracks, chipping and tool wear. High aspect ratios (35:1), thin ceramic carrier (35-50 μm) and nearly no tool wear can be connected with a more than sevenfold higher tool lifetime.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Umweltwissenschaften (insg.)
- Environmental engineering
- Ingenieurwesen (insg.)
- Maschinenbau
- Ingenieurwesen (insg.)
- Wirtschaftsingenieurwesen und Fertigungstechnik
- Physik und Astronomie (insg.)
- Instrumentierung
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2016. Beitrag in 16th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2016, Nottingham, Großbritannien / Vereinigtes Königreich.
Publikation: Konferenzbeitrag › Paper › Forschung › Peer-Review
}
TY - CONF
T1 - Investigation for thinning-by-dicing of sintered and unsintered ceramics
AU - Stompe, Manuel
AU - Asadi, Esmail
AU - Rissing, Lutz
AU - Wurz, Marc
N1 - Copyright: Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2016
Y1 - 2016
N2 - Dicing of hard and brittle materials is still the main choice for machining the same. There are additional manufacturing processes for handling ceramics like silicon carbide, alumina or silica. The mechanical machining of hard and brittle materials are mostly accompanied with induced cracks, chipping, tool wear, sub-surface damage, residual stress and influenced surface zones. These surface and sub-surface failures are adversely for later application of ceramics as a structural or functional part of MEMS. This paper shows a way to manufacture complex ceramic structures out of unsintered pyrophyllite without the negative effects of cracks, chipping and tool wear. High aspect ratios (35:1), thin ceramic carrier (35-50 μm) and nearly no tool wear can be connected with a more than sevenfold higher tool lifetime.
AB - Dicing of hard and brittle materials is still the main choice for machining the same. There are additional manufacturing processes for handling ceramics like silicon carbide, alumina or silica. The mechanical machining of hard and brittle materials are mostly accompanied with induced cracks, chipping, tool wear, sub-surface damage, residual stress and influenced surface zones. These surface and sub-surface failures are adversely for later application of ceramics as a structural or functional part of MEMS. This paper shows a way to manufacture complex ceramic structures out of unsintered pyrophyllite without the negative effects of cracks, chipping and tool wear. High aspect ratios (35:1), thin ceramic carrier (35-50 μm) and nearly no tool wear can be connected with a more than sevenfold higher tool lifetime.
KW - Ceramic
KW - Dicing
KW - Porcelain
KW - Precision cutting
KW - Thinning-by-dicing
UR - http://www.scopus.com/inward/record.url?scp=84984646166&partnerID=8YFLogxK
M3 - Paper
T2 - 16th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2016
Y2 - 30 May 2016 through 3 June 2016
ER -