Interface formation during molecular beam epitaxial growth of neodymium oxide on silicon

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • A. Fissel
  • Z. Elassar
  • O. Kirfel
  • E. Bugiel
  • M. Czernohorsky
  • H. J. Osten
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Aufsatznummer074105
FachzeitschriftJournal of applied physics
Jahrgang99
Ausgabenummer7
Frühes Online-Datum5 Apr. 2006
PublikationsstatusVeröffentlicht - 5 Apr. 2006

Abstract

The Si/dielectric interface properties influence device performance significantly. Often the interface is not stable and changes during and/or after the growth. For a better understanding of the interface and layer formation processes of Nd2 O3 on Si(001), as an example for the lanthanide oxides, well-defined experimental studies by reflection high-energy diffraction and x-ray photoelectron spectroscopy were performed under ultraclean ultrahigh vacuum conditions of molecular beam epitaxy. Complementary investigations were performed by transmission electron microscopy. We found that Nd2 O3 is a candidate for replacing silicon dioxide as gate dielectric in future Si devices with suitable band gap and offset with respect to silicon. However, under ultrahigh vacuum conditions, silicide formation occurs in the initial stage of growth, which can result in large silicide inclusions and hole formation during further growth. This effect can be completely prevented by modifying the oxygen partial pressure during the interface formation and layer growth.

ASJC Scopus Sachgebiete

Zitieren

Interface formation during molecular beam epitaxial growth of neodymium oxide on silicon. / Fissel, A.; Elassar, Z.; Kirfel, O. et al.
in: Journal of applied physics, Jahrgang 99, Nr. 7, 074105, 05.04.2006.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Fissel, A, Elassar, Z, Kirfel, O, Bugiel, E, Czernohorsky, M & Osten, HJ 2006, 'Interface formation during molecular beam epitaxial growth of neodymium oxide on silicon', Journal of applied physics, Jg. 99, Nr. 7, 074105. https://doi.org/10.1063/1.2188051
Fissel, A., Elassar, Z., Kirfel, O., Bugiel, E., Czernohorsky, M., & Osten, H. J. (2006). Interface formation during molecular beam epitaxial growth of neodymium oxide on silicon. Journal of applied physics, 99(7), Artikel 074105. https://doi.org/10.1063/1.2188051
Fissel A, Elassar Z, Kirfel O, Bugiel E, Czernohorsky M, Osten HJ. Interface formation during molecular beam epitaxial growth of neodymium oxide on silicon. Journal of applied physics. 2006 Apr 5;99(7):074105. Epub 2006 Apr 5. doi: 10.1063/1.2188051
Fissel, A. ; Elassar, Z. ; Kirfel, O. et al. / Interface formation during molecular beam epitaxial growth of neodymium oxide on silicon. in: Journal of applied physics. 2006 ; Jahrgang 99, Nr. 7.
Download
@article{41e69a74b2b5430281c4de15131a62f5,
title = "Interface formation during molecular beam epitaxial growth of neodymium oxide on silicon",
abstract = "The Si/dielectric interface properties influence device performance significantly. Often the interface is not stable and changes during and/or after the growth. For a better understanding of the interface and layer formation processes of Nd2 O3 on Si(001), as an example for the lanthanide oxides, well-defined experimental studies by reflection high-energy diffraction and x-ray photoelectron spectroscopy were performed under ultraclean ultrahigh vacuum conditions of molecular beam epitaxy. Complementary investigations were performed by transmission electron microscopy. We found that Nd2 O3 is a candidate for replacing silicon dioxide as gate dielectric in future Si devices with suitable band gap and offset with respect to silicon. However, under ultrahigh vacuum conditions, silicide formation occurs in the initial stage of growth, which can result in large silicide inclusions and hole formation during further growth. This effect can be completely prevented by modifying the oxygen partial pressure during the interface formation and layer growth.",
author = "A. Fissel and Z. Elassar and O. Kirfel and E. Bugiel and M. Czernohorsky and Osten, {H. J.}",
note = "Funding Information: This work was partly funded by the German Federal Ministry of Education and Research (BMBF) under the KrisMOS project (01M3142D).",
year = "2006",
month = apr,
day = "5",
doi = "10.1063/1.2188051",
language = "English",
volume = "99",
journal = "Journal of applied physics",
issn = "0021-8979",
publisher = "American Institute of Physics",
number = "7",

}

Download

TY - JOUR

T1 - Interface formation during molecular beam epitaxial growth of neodymium oxide on silicon

AU - Fissel, A.

AU - Elassar, Z.

AU - Kirfel, O.

AU - Bugiel, E.

AU - Czernohorsky, M.

AU - Osten, H. J.

N1 - Funding Information: This work was partly funded by the German Federal Ministry of Education and Research (BMBF) under the KrisMOS project (01M3142D).

PY - 2006/4/5

Y1 - 2006/4/5

N2 - The Si/dielectric interface properties influence device performance significantly. Often the interface is not stable and changes during and/or after the growth. For a better understanding of the interface and layer formation processes of Nd2 O3 on Si(001), as an example for the lanthanide oxides, well-defined experimental studies by reflection high-energy diffraction and x-ray photoelectron spectroscopy were performed under ultraclean ultrahigh vacuum conditions of molecular beam epitaxy. Complementary investigations were performed by transmission electron microscopy. We found that Nd2 O3 is a candidate for replacing silicon dioxide as gate dielectric in future Si devices with suitable band gap and offset with respect to silicon. However, under ultrahigh vacuum conditions, silicide formation occurs in the initial stage of growth, which can result in large silicide inclusions and hole formation during further growth. This effect can be completely prevented by modifying the oxygen partial pressure during the interface formation and layer growth.

AB - The Si/dielectric interface properties influence device performance significantly. Often the interface is not stable and changes during and/or after the growth. For a better understanding of the interface and layer formation processes of Nd2 O3 on Si(001), as an example for the lanthanide oxides, well-defined experimental studies by reflection high-energy diffraction and x-ray photoelectron spectroscopy were performed under ultraclean ultrahigh vacuum conditions of molecular beam epitaxy. Complementary investigations were performed by transmission electron microscopy. We found that Nd2 O3 is a candidate for replacing silicon dioxide as gate dielectric in future Si devices with suitable band gap and offset with respect to silicon. However, under ultrahigh vacuum conditions, silicide formation occurs in the initial stage of growth, which can result in large silicide inclusions and hole formation during further growth. This effect can be completely prevented by modifying the oxygen partial pressure during the interface formation and layer growth.

UR - http://www.scopus.com/inward/record.url?scp=33645932313&partnerID=8YFLogxK

U2 - 10.1063/1.2188051

DO - 10.1063/1.2188051

M3 - Article

AN - SCOPUS:33645932313

VL - 99

JO - Journal of applied physics

JF - Journal of applied physics

SN - 0021-8979

IS - 7

M1 - 074105

ER -