Details
| Originalsprache | Englisch |
|---|---|
| Aufsatznummer | 109991 |
| Fachzeitschrift | Solar Energy Materials and Solar Cells |
| Jahrgang | 200 |
| Frühes Online-Datum | 22 Juni 2019 |
| Publikationsstatus | Veröffentlicht - 15 Sept. 2019 |
Abstract
We present a module fabrication process enabling gap-free interconnection of c-Si solar cells using solder-based interconnection technology with ribbons or wires. The interconnect-shingling process increases the module efficiency by avoiding the gaps between the solar cells. The process is applicable to bifacial cells and uses well-proven interconnection technologies. In contrast to previous adhesive-based shingled modules, the current transport is supported by interconnects, thus reducing the silver consumption for the cells’ metallization and avoiding cell overlap. We lay down the cells on structured encapsulant layers to reduce mechanical stress at the cell edges during lamination. Alternatively, the lamination process can be adapted to allow the encapsulant to reflow. This also results in a low pressure at sensitive cell parts. Both approaches avoid crack formation. We demonstrate the interconnect-shingling process with a proof-of-concept module having a aperture area efficiency of 22.1%. Applying 200 thermal cycles does not cause any crack formation.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Energie (insg.)
- Erneuerbare Energien, Nachhaltigkeit und Umwelt
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
Ziele für nachhaltige Entwicklung
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in: Solar Energy Materials and Solar Cells, Jahrgang 200, 109991, 15.09.2019.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Interconnect-shingling
T2 - Maximizing the active module area with conventional module processes
AU - Schulte-Huxel, Henning
AU - Blankemeyer, Susanne
AU - Morlier, Arnaud
AU - Brendel, Rolf
AU - Köntges, Marc
N1 - Funding Information: The authors would like to Peter Giesel for cell measurements and Iris Kunze for support of module processing and measurements. We also thank Robert Witteck for fruitful discussion. This work was funded by the state of Lower Saxony and the Federal Ministry for Economic Affairs and Energy (BMWi) under grant number 0324171C (NextStep).
PY - 2019/9/15
Y1 - 2019/9/15
N2 - We present a module fabrication process enabling gap-free interconnection of c-Si solar cells using solder-based interconnection technology with ribbons or wires. The interconnect-shingling process increases the module efficiency by avoiding the gaps between the solar cells. The process is applicable to bifacial cells and uses well-proven interconnection technologies. In contrast to previous adhesive-based shingled modules, the current transport is supported by interconnects, thus reducing the silver consumption for the cells’ metallization and avoiding cell overlap. We lay down the cells on structured encapsulant layers to reduce mechanical stress at the cell edges during lamination. Alternatively, the lamination process can be adapted to allow the encapsulant to reflow. This also results in a low pressure at sensitive cell parts. Both approaches avoid crack formation. We demonstrate the interconnect-shingling process with a proof-of-concept module having a aperture area efficiency of 22.1%. Applying 200 thermal cycles does not cause any crack formation.
AB - We present a module fabrication process enabling gap-free interconnection of c-Si solar cells using solder-based interconnection technology with ribbons or wires. The interconnect-shingling process increases the module efficiency by avoiding the gaps between the solar cells. The process is applicable to bifacial cells and uses well-proven interconnection technologies. In contrast to previous adhesive-based shingled modules, the current transport is supported by interconnects, thus reducing the silver consumption for the cells’ metallization and avoiding cell overlap. We lay down the cells on structured encapsulant layers to reduce mechanical stress at the cell edges during lamination. Alternatively, the lamination process can be adapted to allow the encapsulant to reflow. This also results in a low pressure at sensitive cell parts. Both approaches avoid crack formation. We demonstrate the interconnect-shingling process with a proof-of-concept module having a aperture area efficiency of 22.1%. Applying 200 thermal cycles does not cause any crack formation.
KW - High efficiency PV modules
KW - Module integration
KW - Shingled interconnection
KW - Solar cell interconnection
UR - http://www.scopus.com/inward/record.url?scp=85067622311&partnerID=8YFLogxK
U2 - 10.1016/j.solmat.2019.109991
DO - 10.1016/j.solmat.2019.109991
M3 - Article
AN - SCOPUS:85067622311
VL - 200
JO - Solar Energy Materials and Solar Cells
JF - Solar Energy Materials and Solar Cells
SN - 0927-0248
M1 - 109991
ER -