Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
| Herausgeber (Verlag) | VDE Verlag GmbH |
| Seiten | 154-161 |
| Seitenumfang | 8 |
| ISBN (elektronisch) | 9783800762040 |
| Publikationsstatus | Veröffentlicht - 2023 |
| Veranstaltung | MikroSystemTechnik Kongress 2023: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat MicroSystems - Dresden, Deutschland Dauer: 23 Okt. 2023 → 25 Okt. 2023 |
Publikationsreihe
| Name | MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings |
|---|
Abstract
The optimal placement of sensors in components is often challenging and associated with great manufacturing effort and high costs. At the IMPT, sensor systems have already been successfully manufactured on injection-moulded laser direct structurable (LDS) plastics and electrically contacted by means of LDS [1, 2, 3]. In order to expand the existing range of applications with further advantageous manufacturing processes, the possibility of combining additive manufacturing and LDS is now being investigated with regard to the possibilities of sensor positioning. For this purpose, components are manufactured from LDS capable filament using the FLM process, thin-film-based sensors are completely embedded in them and then electrically contacted using the LDS process.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
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- BibTex
- RIS
MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings. VDE Verlag GmbH, 2023. S. 154-161 (MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Integration of film-based sensor technology in additively manufactured components
AU - Basten, Robin G.
AU - Bengsch, Sebastian
AU - Wurz, Marc C.
N1 - Publisher Copyright: © VDE VERLAG GMBH ∙ Berlin ∙ Offenbach.
PY - 2023
Y1 - 2023
N2 - The optimal placement of sensors in components is often challenging and associated with great manufacturing effort and high costs. At the IMPT, sensor systems have already been successfully manufactured on injection-moulded laser direct structurable (LDS) plastics and electrically contacted by means of LDS [1, 2, 3]. In order to expand the existing range of applications with further advantageous manufacturing processes, the possibility of combining additive manufacturing and LDS is now being investigated with regard to the possibilities of sensor positioning. For this purpose, components are manufactured from LDS capable filament using the FLM process, thin-film-based sensors are completely embedded in them and then electrically contacted using the LDS process.
AB - The optimal placement of sensors in components is often challenging and associated with great manufacturing effort and high costs. At the IMPT, sensor systems have already been successfully manufactured on injection-moulded laser direct structurable (LDS) plastics and electrically contacted by means of LDS [1, 2, 3]. In order to expand the existing range of applications with further advantageous manufacturing processes, the possibility of combining additive manufacturing and LDS is now being investigated with regard to the possibilities of sensor positioning. For this purpose, components are manufactured from LDS capable filament using the FLM process, thin-film-based sensors are completely embedded in them and then electrically contacted using the LDS process.
UR - http://www.scopus.com/inward/record.url?scp=85196917784&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85196917784
T3 - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
SP - 154
EP - 161
BT - MikroSystemTechnik Kongress 2023 - Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Nachhaltigkeit und Technologiesouveranitat, Proceedings
PB - VDE Verlag GmbH
T2 - Technology Congress 2023
Y2 - 23 October 2023 through 25 October 2023
ER -