Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | Integrated Photonics Research, Silicon and Nanophotonics, IPRSN 2019 |
| Herausgeber (Verlag) | OSA - The Optical Society |
| ISBN (elektronisch) | 9781557528209 |
| ISBN (Print) | 9781943580644 |
| Publikationsstatus | Veröffentlicht - 2019 |
| Extern publiziert | Ja |
| Veranstaltung | Integrated Photonics Research, Silicon and Nanophotonics, IPRSN 2019 - Burlingame, USA / Vereinigte Staaten Dauer: 29 Juli 2019 → 1 Aug. 2019 |
Publikationsreihe
| Name | Optics InfoBase Conference Papers |
|---|---|
| Band | Part F131-IPRSN 2019 |
Abstract
The heterogeneous integration of AlGaAs-on-insulator has great potential for nonlinear optics. This talk will explore chip-scale bonding and transfer printing techniques for the development of integrated photonic chips for second- and third-order non-linear applications.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Ingenieurwesen (insg.)
- Werkstoffmechanik
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Integrated Photonics Research, Silicon and Nanophotonics, IPRSN 2019. OSA - The Optical Society, 2019. (Optics InfoBase Conference Papers; Band Part F131-IPRSN 2019).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Integrated AlGaAs devices for non-linear applications
AU - May, Stuart
AU - McPhillimy, J.
AU - Klitis, C.
AU - Guilhabert, B.
AU - Kues, Michael
AU - Dawson, M. D.
AU - Strain, M. J.
AU - Clerici, Matteo
AU - Sorel, Marc
N1 - Publisher Copyright: © 2019 The Author(s). Copyright: Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2019
Y1 - 2019
N2 - The heterogeneous integration of AlGaAs-on-insulator has great potential for nonlinear optics. This talk will explore chip-scale bonding and transfer printing techniques for the development of integrated photonic chips for second- and third-order non-linear applications.
AB - The heterogeneous integration of AlGaAs-on-insulator has great potential for nonlinear optics. This talk will explore chip-scale bonding and transfer printing techniques for the development of integrated photonic chips for second- and third-order non-linear applications.
UR - http://www.scopus.com/inward/record.url?scp=85077199587&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85077199587
SN - 9781943580644
T3 - Optics InfoBase Conference Papers
BT - Integrated Photonics Research, Silicon and Nanophotonics, IPRSN 2019
PB - OSA - The Optical Society
T2 - Integrated Photonics Research, Silicon and Nanophotonics, IPRSN 2019
Y2 - 29 July 2019 through 1 August 2019
ER -