Influence of wood moisture content and wood temperature on fungal decay in the field: Observations in different micro-climates

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • Christian Brischke
  • Andreas Otto Rapp
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Details

OriginalspracheEnglisch
Seiten (von - bis)663-677
Seitenumfang15
FachzeitschriftWood science and technology
Jahrgang42
Ausgabenummer8
Frühes Online-Datum3 Apr. 2008
PublikationsstatusVeröffentlicht - Dez. 2008

Abstract

In this study, Scots pine sapwood (Pinus sylvestris L.) and Douglas fir heartwood (Pseudotsuga menziesii Franco) specimens were exposed in double layer field trials at four different exposure sites and under different exposure conditions (in total ten test sets). The material climate of wood in terms of wood moisture content (MC) and wood temperature was automatically monitored over a period of 6 years and compared with the progress of decay. The aim of this study was to highlight the interrelationship between microclimate, material climate, and decay as a basis for the establishment of dose-response functions to be used for service life prediction of wood and wood-based products. Differences in resulting decay dynamics between the test sites as well as between the different types of exposure were quantified and discussed with respect to corresponding microclimatic and material climatic conditions. The time between the beginning of exposure and the first occurrence of visible decay varied between the sites and influenced the total decay development. The fundamental importance of direct decay factors, such as MC and wood temperature, were underlined and basic requirements for establishing dose-response-functions to be used in service life prediction models were derived.

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Influence of wood moisture content and wood temperature on fungal decay in the field: Observations in different micro-climates. / Brischke, Christian; Rapp, Andreas Otto.
in: Wood science and technology, Jahrgang 42, Nr. 8, 12.2008, S. 663-677.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

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