Influence of Software Effects on the Susceptibility of Ethernet Connections

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Autoren

  • Matthias Kreitlow
  • Heyno Garbe
  • Frank Sabath

Externe Organisationen

  • Wehrwissenschaftliches Institut Für Schutztechnologien - ABC-Schutz (WIS)
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des Sammelwerks2014 IEEE International Symposium on Electromagnetic Compatibility
UntertitelEMC
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers Inc.
Seiten544-548
Seitenumfang5
AuflageSeptember
ISBN (elektronisch)9781479955442
PublikationsstatusVeröffentlicht - 2014
Veranstaltung2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014 - Raleigh, USA / Vereinigte Staaten
Dauer: 3 Aug. 20148 Aug. 2014

Publikationsreihe

NameIEEE International Symposium on Electromagnetic Compatibility
NummerSeptember
Band2014-September
ISSN (Print)1077-4076
ISSN (elektronisch)2158-1118

Abstract

It is widely known that Ethernet networks are susceptible to high-power electromagnetics (HPEM). Even with electromagnetic disturbance levels below the threshold, at which a hardware failure of components can be observed, there are impacts on the data transmission between two computers. A typical effect on the application level is a decrease of the maximum data rate between two endpoints with a higher field strength until the transmission completely breaks down. To quantify the effect of electromagnetic disturbances it is necessary to distinguish between effects which are software-related due to control algorithms and applications behaviour on higher protocol layers, and hardware-related effects caused by physical interaction between the network components and the disturbance. This paper shows the results of a new measurement method compared to classical tests using a FTP data transmission.

ASJC Scopus Sachgebiete

Zitieren

Influence of Software Effects on the Susceptibility of Ethernet Connections. / Kreitlow, Matthias; Garbe, Heyno; Sabath, Frank.
2014 IEEE International Symposium on Electromagnetic Compatibility: EMC. September. Aufl. Institute of Electrical and Electronics Engineers Inc., 2014. S. 544-548 6899031 (IEEE International Symposium on Electromagnetic Compatibility; Band 2014-September, Nr. September).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/KonferenzbandAufsatz in KonferenzbandForschungPeer-Review

Kreitlow, M, Garbe, H & Sabath, F 2014, Influence of Software Effects on the Susceptibility of Ethernet Connections. in 2014 IEEE International Symposium on Electromagnetic Compatibility: EMC. September Aufl., 6899031, IEEE International Symposium on Electromagnetic Compatibility, Nr. September, Bd. 2014-September, Institute of Electrical and Electronics Engineers Inc., S. 544-548, 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014, Raleigh, USA / Vereinigte Staaten, 3 Aug. 2014. https://doi.org/10.1109/ISEMC.2014.6899031
Kreitlow, M., Garbe, H., & Sabath, F. (2014). Influence of Software Effects on the Susceptibility of Ethernet Connections. In 2014 IEEE International Symposium on Electromagnetic Compatibility: EMC (September Aufl., S. 544-548). Artikel 6899031 (IEEE International Symposium on Electromagnetic Compatibility; Band 2014-September, Nr. September). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISEMC.2014.6899031
Kreitlow M, Garbe H, Sabath F. Influence of Software Effects on the Susceptibility of Ethernet Connections. in 2014 IEEE International Symposium on Electromagnetic Compatibility: EMC. September Aufl. Institute of Electrical and Electronics Engineers Inc. 2014. S. 544-548. 6899031. (IEEE International Symposium on Electromagnetic Compatibility; September). doi: 10.1109/ISEMC.2014.6899031
Kreitlow, Matthias ; Garbe, Heyno ; Sabath, Frank. / Influence of Software Effects on the Susceptibility of Ethernet Connections. 2014 IEEE International Symposium on Electromagnetic Compatibility: EMC. September. Aufl. Institute of Electrical and Electronics Engineers Inc., 2014. S. 544-548 (IEEE International Symposium on Electromagnetic Compatibility; September).
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