Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
| Publikationsstatus | Veröffentlicht - 2013 |
| Veranstaltung | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 - Wroclaw, Polen Dauer: 14 Apr. 2013 → 17 Apr. 2013 |
Publikationsreihe
| Name | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
|---|
Abstract
Two main trends in IC packaging are the progress in integration on package level (e.g. System in Package) and the use of ICs under harsh environmental conditions e.g. in sensors for intelligent actuators. The second task often requires very low failure rates below 1ppm. To clarify the reasons for the existing lifetime distribution during reliability tests, the influence of geometry variations on the lifetime of solder joints is investigated. The dimensions of 339 solder contacts for Package-on-Package systems were measured. The resulting mean values and the standard deviations were used to design a FEM model of Package-on-Package solder joints. The FEM model was used for the simulation of electromigration reliability tests. The mass flux and the mass flux divergences due to electromigration were investigated. As a range of variation, three standard deviations were chosen, so that 99.73% of all possible solder contacts will be covered by this investigation. Finally, the simulation results of the parameter study were compared with the results of the physical electromigration lifetime tests.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Mathematik (insg.)
- Modellierung und Simulation
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529895 (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing
AU - Meinshausen, L.
AU - Weide-Zaage, K.
AU - Frémont, H.
N1 - Copyright: Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - Two main trends in IC packaging are the progress in integration on package level (e.g. System in Package) and the use of ICs under harsh environmental conditions e.g. in sensors for intelligent actuators. The second task often requires very low failure rates below 1ppm. To clarify the reasons for the existing lifetime distribution during reliability tests, the influence of geometry variations on the lifetime of solder joints is investigated. The dimensions of 339 solder contacts for Package-on-Package systems were measured. The resulting mean values and the standard deviations were used to design a FEM model of Package-on-Package solder joints. The FEM model was used for the simulation of electromigration reliability tests. The mass flux and the mass flux divergences due to electromigration were investigated. As a range of variation, three standard deviations were chosen, so that 99.73% of all possible solder contacts will be covered by this investigation. Finally, the simulation results of the parameter study were compared with the results of the physical electromigration lifetime tests.
AB - Two main trends in IC packaging are the progress in integration on package level (e.g. System in Package) and the use of ICs under harsh environmental conditions e.g. in sensors for intelligent actuators. The second task often requires very low failure rates below 1ppm. To clarify the reasons for the existing lifetime distribution during reliability tests, the influence of geometry variations on the lifetime of solder joints is investigated. The dimensions of 339 solder contacts for Package-on-Package systems were measured. The resulting mean values and the standard deviations were used to design a FEM model of Package-on-Package solder joints. The FEM model was used for the simulation of electromigration reliability tests. The mass flux and the mass flux divergences due to electromigration were investigated. As a range of variation, three standard deviations were chosen, so that 99.73% of all possible solder contacts will be covered by this investigation. Finally, the simulation results of the parameter study were compared with the results of the physical electromigration lifetime tests.
UR - http://www.scopus.com/inward/record.url?scp=84880988532&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2013.6529895
DO - 10.1109/EuroSimE.2013.6529895
M3 - Conference contribution
AN - SCOPUS:84880988532
SN - 9781467361385
T3 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
BT - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
T2 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
Y2 - 14 April 2013 through 17 April 2013
ER -