Influence of AFP process parameters on the temperature distribution used for thermal in-process monitoring

Publikation: Beitrag in FachzeitschriftKonferenzaufsatz in FachzeitschriftForschungPeer-Review

Autoren

  • C. Schmidt
  • B. Denkena
  • T. Hocke
  • K. Völtzer
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Seiten (von - bis)68-73
Seitenumfang6
FachzeitschriftProcedia CIRP
Jahrgang66
PublikationsstatusVeröffentlicht - 6 Juni 2017
Veranstaltung1st CIRP Conference on Composite Materials Parts Manufacturing, CIRP CCMPM 2017 - Karlsruhe, Deutschland
Dauer: 8 Juni 20179 Juni 2017

Abstract

Automated Fiber Placement is an important manufacturing process when it comes to aerospace part generation. To minimize the machine downtime, an online monitoring system is necessary to prevent time consuming visual inspection. Therefore, a new thermal in-process monitoring system is integrated. Herewith spotted temperature difference enable the localization of placed tows and detection of defects. The thermal contrast between subsurface and tows depends on different process parameters such as lay-up speed, tooling temperature and compaction pressure. This influence is analyzed and discussed within lay-up studies to gain further knowledge about the different effects to increase the reliability of in-process monitoring as well as AFP processes.

ASJC Scopus Sachgebiete

Zitieren

Influence of AFP process parameters on the temperature distribution used for thermal in-process monitoring. / Schmidt, C.; Denkena, B.; Hocke, T. et al.
in: Procedia CIRP, Jahrgang 66, 06.06.2017, S. 68-73.

Publikation: Beitrag in FachzeitschriftKonferenzaufsatz in FachzeitschriftForschungPeer-Review

Schmidt C, Denkena B, Hocke T, Völtzer K. Influence of AFP process parameters on the temperature distribution used for thermal in-process monitoring. Procedia CIRP. 2017 Jun 6;66:68-73. doi: 10.1016/j.procir.2017.03.220
Schmidt, C. ; Denkena, B. ; Hocke, T. et al. / Influence of AFP process parameters on the temperature distribution used for thermal in-process monitoring. in: Procedia CIRP. 2017 ; Jahrgang 66. S. 68-73.
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