Impact of PCB layout design on final product's EMI compliance

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

Autoren

  • Kye Yak See
  • Manish Oswal
  • Werachet Khan-Ngern
  • Flavio Canavero
  • Christos Christopoulos
  • Hartmut Grabinski

Organisationseinheiten

Externe Organisationen

  • Nanyang Technological University (NTU)
  • King Mongkut's Institute of Technology Ladkrabang
  • Politecnico di Torino (POLITO)
  • University of Nottingham
Forschungs-netzwerk anzeigen

Details

OriginalspracheEnglisch
Titel des Sammelwerks17th International Zurich Symposium on Electromagnetic Compatibility, 2006
Seiten553-556
Seitenumfang4
PublikationsstatusVeröffentlicht - 2006
Veranstaltung17th International Zurich Symposium on Electromagnetic Compatibility, 2006 - Singapur, Singapur
Dauer: 27 Feb. 2006 → 3 März 2006

Publikationsreihe

Name17th International Zurich Symposium on Electromagnetic Compatibility, 2006
Band2006

Abstract

Most design engineers still believe that with a good shielded enclosure, well-shielded cables and high-performance ferrite sleeves, EMI compliance will be a straight forward task. This paper demonstartes experimentally that a poor PCB layout can cause electronic product to fail EMI specification badly even with all these fixes.

ASJC Scopus Sachgebiete

Zitieren

Impact of PCB layout design on final product's EMI compliance. / See, Kye Yak; Oswal, Manish; Khan-Ngern, Werachet et al.
17th International Zurich Symposium on Electromagnetic Compatibility, 2006. 2006. S. 553-556 1629684 (17th International Zurich Symposium on Electromagnetic Compatibility, 2006; Band 2006).

Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review

See, KY, Oswal, M, Khan-Ngern, W, Canavero, F, Christopoulos, C & Grabinski, H 2006, Impact of PCB layout design on final product's EMI compliance. in 17th International Zurich Symposium on Electromagnetic Compatibility, 2006., 1629684, 17th International Zurich Symposium on Electromagnetic Compatibility, 2006, Bd. 2006, S. 553-556, 17th International Zurich Symposium on Electromagnetic Compatibility, 2006, Singapur, Singapur, 27 Feb. 2006. https://doi.org/10.1109/EMCZUR.2006.214994
See, K. Y., Oswal, M., Khan-Ngern, W., Canavero, F., Christopoulos, C., & Grabinski, H. (2006). Impact of PCB layout design on final product's EMI compliance. In 17th International Zurich Symposium on Electromagnetic Compatibility, 2006 (S. 553-556). Artikel 1629684 (17th International Zurich Symposium on Electromagnetic Compatibility, 2006; Band 2006). https://doi.org/10.1109/EMCZUR.2006.214994
See KY, Oswal M, Khan-Ngern W, Canavero F, Christopoulos C, Grabinski H. Impact of PCB layout design on final product's EMI compliance. in 17th International Zurich Symposium on Electromagnetic Compatibility, 2006. 2006. S. 553-556. 1629684. (17th International Zurich Symposium on Electromagnetic Compatibility, 2006). doi: 10.1109/EMCZUR.2006.214994
See, Kye Yak ; Oswal, Manish ; Khan-Ngern, Werachet et al. / Impact of PCB layout design on final product's EMI compliance. 17th International Zurich Symposium on Electromagnetic Compatibility, 2006. 2006. S. 553-556 (17th International Zurich Symposium on Electromagnetic Compatibility, 2006).
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@inproceedings{5efa7ab835504686a8b1285237582629,
title = "Impact of PCB layout design on final product's EMI compliance",
abstract = "Most design engineers still believe that with a good shielded enclosure, well-shielded cables and high-performance ferrite sleeves, EMI compliance will be a straight forward task. This paper demonstartes experimentally that a poor PCB layout can cause electronic product to fail EMI specification badly even with all these fixes.",
author = "See, {Kye Yak} and Manish Oswal and Werachet Khan-Ngern and Flavio Canavero and Christos Christopoulos and Hartmut Grabinski",
year = "2006",
doi = "10.1109/EMCZUR.2006.214994",
language = "English",
isbn = "3952299049",
series = "17th International Zurich Symposium on Electromagnetic Compatibility, 2006",
pages = "553--556",
booktitle = "17th International Zurich Symposium on Electromagnetic Compatibility, 2006",
note = "17th International Zurich Symposium on Electromagnetic Compatibility, 2006 ; Conference date: 27-02-2006 Through 03-03-2006",

}

Download

TY - GEN

T1 - Impact of PCB layout design on final product's EMI compliance

AU - See, Kye Yak

AU - Oswal, Manish

AU - Khan-Ngern, Werachet

AU - Canavero, Flavio

AU - Christopoulos, Christos

AU - Grabinski, Hartmut

PY - 2006

Y1 - 2006

N2 - Most design engineers still believe that with a good shielded enclosure, well-shielded cables and high-performance ferrite sleeves, EMI compliance will be a straight forward task. This paper demonstartes experimentally that a poor PCB layout can cause electronic product to fail EMI specification badly even with all these fixes.

AB - Most design engineers still believe that with a good shielded enclosure, well-shielded cables and high-performance ferrite sleeves, EMI compliance will be a straight forward task. This paper demonstartes experimentally that a poor PCB layout can cause electronic product to fail EMI specification badly even with all these fixes.

UR - http://www.scopus.com/inward/record.url?scp=33751070515&partnerID=8YFLogxK

U2 - 10.1109/EMCZUR.2006.214994

DO - 10.1109/EMCZUR.2006.214994

M3 - Conference contribution

AN - SCOPUS:33751070515

SN - 3952299049

SN - 9783952299043

T3 - 17th International Zurich Symposium on Electromagnetic Compatibility, 2006

SP - 553

EP - 556

BT - 17th International Zurich Symposium on Electromagnetic Compatibility, 2006

T2 - 17th International Zurich Symposium on Electromagnetic Compatibility, 2006

Y2 - 27 February 2006 through 3 March 2006

ER -