Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 1079-1088 |
| Seitenumfang | 10 |
| Fachzeitschrift | Microelectronics reliability |
| Jahrgang | 39 |
| Ausgabenummer | 6-7 |
| Publikationsstatus | Veröffentlicht - 1999 |
| Veranstaltung | 1999 10th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 99) - Arcachon, FR Dauer: 5 Okt. 1999 → 8 Okt. 1999 |
Abstract
An important role of packages is the protection of the chip to environmental influences like moisture, pollutants and other chemical active species. If the chip is exposed these influences for instance corrosion is resulting and it may come to early failures. The reliability of the package is affected by thermo-mechanical stress. Due to this, an essential aspect of the package design is the careful combination of materials to avoid mechanical stress and to improve the thermal resistance of the package, which is significant for example in power or automotive applications. For a reduction of the mechanical stress, a good heat conductivity into the ambient and by this a small thermal resistance of the package should be aspired. Finite element analysis (FEM) can give a fast and reliable solution to investigate the influence of mechanical stress as well as the thermal behaviour of the package, depending on the material properties and on the package geometry. For the finite element analysis special boundary conditions like convection and radiation and the influence of the board have to be taken into account.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: Microelectronics reliability, Jahrgang 39, Nr. 6-7, 1999, S. 1079-1088.
Publikation: Beitrag in Fachzeitschrift › Konferenzaufsatz in Fachzeitschrift › Forschung › Peer-Review
}
TY - JOUR
T1 - Impact of FEM simulation on reliability improvement of packaging
AU - Weide, Kirsten
N1 - Copyright: Copyright 2018 Elsevier B.V., All rights reserved.
PY - 1999
Y1 - 1999
N2 - An important role of packages is the protection of the chip to environmental influences like moisture, pollutants and other chemical active species. If the chip is exposed these influences for instance corrosion is resulting and it may come to early failures. The reliability of the package is affected by thermo-mechanical stress. Due to this, an essential aspect of the package design is the careful combination of materials to avoid mechanical stress and to improve the thermal resistance of the package, which is significant for example in power or automotive applications. For a reduction of the mechanical stress, a good heat conductivity into the ambient and by this a small thermal resistance of the package should be aspired. Finite element analysis (FEM) can give a fast and reliable solution to investigate the influence of mechanical stress as well as the thermal behaviour of the package, depending on the material properties and on the package geometry. For the finite element analysis special boundary conditions like convection and radiation and the influence of the board have to be taken into account.
AB - An important role of packages is the protection of the chip to environmental influences like moisture, pollutants and other chemical active species. If the chip is exposed these influences for instance corrosion is resulting and it may come to early failures. The reliability of the package is affected by thermo-mechanical stress. Due to this, an essential aspect of the package design is the careful combination of materials to avoid mechanical stress and to improve the thermal resistance of the package, which is significant for example in power or automotive applications. For a reduction of the mechanical stress, a good heat conductivity into the ambient and by this a small thermal resistance of the package should be aspired. Finite element analysis (FEM) can give a fast and reliable solution to investigate the influence of mechanical stress as well as the thermal behaviour of the package, depending on the material properties and on the package geometry. For the finite element analysis special boundary conditions like convection and radiation and the influence of the board have to be taken into account.
UR - http://www.scopus.com/inward/record.url?scp=0033143169&partnerID=8YFLogxK
U2 - 10.1016/S0026-2714(99)00153-5
DO - 10.1016/S0026-2714(99)00153-5
M3 - Conference article
AN - SCOPUS:0033143169
VL - 39
SP - 1079
EP - 1088
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 6-7
T2 - 1999 10th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 99)
Y2 - 5 October 1999 through 8 October 1999
ER -