Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2017 25th Iranian Conference on Electrical Engineering, ICEE 2017 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seiten | 1308-1312 |
| Seitenumfang | 5 |
| ISBN (elektronisch) | 9781509059638 |
| Publikationsstatus | Veröffentlicht - 19 Juli 2017 |
| Veranstaltung | 25th Iranian Conference on Electrical Engineering, ICEE 2017 - Tehran, Iran Dauer: 2 Mai 2017 → 4 Mai 2017 |
Abstract
Six different bonding methods are discussed briefly. In order to find methods with least induced voltage and current, EMTP software is used to investigate the effect of these configurations on shield induced voltage and current. Normal and core to shield short circuit conditions, and surge over-voltage (lightning) are considered in simulations. Finally appropriate bonding methods for different conditions are proposed.
ASJC Scopus Sachgebiete
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
- Mathematik (insg.)
- Steuerung und Optimierung
- Energie (insg.)
- Energieanlagenbau und Kraftwerkstechnik
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2017 25th Iranian Conference on Electrical Engineering, ICEE 2017. Institute of Electrical and Electronics Engineers Inc., 2017. S. 1308-1312 7985244.
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Impact of different bonding methods on high voltage cable shield induced voltage and current in normal and fault conditions
AU - Mahdipour, Mahdi
AU - Akbari Azirani, Asghar
AU - Khalilzadeh, Mohammad
AU - Werle, Peter
N1 - Publisher Copyright: © 2017 IEEE. Copyright: Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/7/19
Y1 - 2017/7/19
N2 - Six different bonding methods are discussed briefly. In order to find methods with least induced voltage and current, EMTP software is used to investigate the effect of these configurations on shield induced voltage and current. Normal and core to shield short circuit conditions, and surge over-voltage (lightning) are considered in simulations. Finally appropriate bonding methods for different conditions are proposed.
AB - Six different bonding methods are discussed briefly. In order to find methods with least induced voltage and current, EMTP software is used to investigate the effect of these configurations on shield induced voltage and current. Normal and core to shield short circuit conditions, and surge over-voltage (lightning) are considered in simulations. Finally appropriate bonding methods for different conditions are proposed.
KW - Bonding
KW - Induced current
KW - Induced voltage
KW - Shield
UR - http://www.scopus.com/inward/record.url?scp=85032786975&partnerID=8YFLogxK
U2 - 10.1109/IranianCEE.2017.7985244
DO - 10.1109/IranianCEE.2017.7985244
M3 - Conference contribution
AN - SCOPUS:85032786975
SP - 1308
EP - 1312
BT - 2017 25th Iranian Conference on Electrical Engineering, ICEE 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 25th Iranian Conference on Electrical Engineering, ICEE 2017
Y2 - 2 May 2017 through 4 May 2017
ER -