Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 99058-99064 |
| Seitenumfang | 7 |
| Fachzeitschrift | RSC Advances |
| Jahrgang | 5 |
| Ausgabenummer | 120 |
| Publikationsstatus | Veröffentlicht - 2015 |
Abstract
The effect of Al on the corrosion resistance behaviour of Pb-free Sn-1.0Ag-0.5Cu-xAl solder (x = 0.2 wt%, 0.5 wt% and 1.0 wt%) in 5% NaCl solution was investigated by using potentiodynamic polarization and salt spray exposure. Passivation behaviour was evident in all the solder formulations containing Al, compared to the base SAC solder. FESEM and XRD results revealed that more dense passive films were formed on the solder containing Al, compared to the base solder. These passivation films contained intermetallic compounds such as Al 2O 3, AlCuO 4, SnO and SnO 2 served to prevent further reaction on the material surface. Polarization studies showed that the corrosion rate was 30% and 6% lower for alloys with 0.5 wt% and 0.2 wt% Al content, respectively, even though the corrosion potential shifted towards more negative values. The Al-added solder alloys exhibit more refined surface after exposure in the salt spray chamber and revealed no visible infiltration of aggressive ions at the solder-substrate joint. This work suggests a corrosion mitigation strategy for SAC 105 solder through doping of Al.
ASJC Scopus Sachgebiete
- Chemie (insg.)
- Allgemeine Chemie
- Chemische Verfahrenstechnik (insg.)
- Allgemeine chemische Verfahrenstechnik
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in: RSC Advances, Jahrgang 5, Nr. 120, 2015, S. 99058-99064.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Impact of aluminium addition on the corrosion behaviour of Sn-1.0Ag-0.5Cu lead-free solder
AU - Nordin, N. I.M.
AU - Said, S. M.
AU - Ramli, R.
AU - Weide-Zaage, K.
AU - Sabri, M. F.M.
AU - Mamat, A.
AU - Ibrahim, N. N.S.
AU - Mainal, A.
AU - Datta, R. S.
N1 - Publisher Copyright: © 2015 The Royal Society of Chemistry. Copyright: Copyright 2015 Elsevier B.V., All rights reserved.
PY - 2015
Y1 - 2015
N2 - The effect of Al on the corrosion resistance behaviour of Pb-free Sn-1.0Ag-0.5Cu-xAl solder (x = 0.2 wt%, 0.5 wt% and 1.0 wt%) in 5% NaCl solution was investigated by using potentiodynamic polarization and salt spray exposure. Passivation behaviour was evident in all the solder formulations containing Al, compared to the base SAC solder. FESEM and XRD results revealed that more dense passive films were formed on the solder containing Al, compared to the base solder. These passivation films contained intermetallic compounds such as Al 2O 3, AlCuO 4, SnO and SnO 2 served to prevent further reaction on the material surface. Polarization studies showed that the corrosion rate was 30% and 6% lower for alloys with 0.5 wt% and 0.2 wt% Al content, respectively, even though the corrosion potential shifted towards more negative values. The Al-added solder alloys exhibit more refined surface after exposure in the salt spray chamber and revealed no visible infiltration of aggressive ions at the solder-substrate joint. This work suggests a corrosion mitigation strategy for SAC 105 solder through doping of Al.
AB - The effect of Al on the corrosion resistance behaviour of Pb-free Sn-1.0Ag-0.5Cu-xAl solder (x = 0.2 wt%, 0.5 wt% and 1.0 wt%) in 5% NaCl solution was investigated by using potentiodynamic polarization and salt spray exposure. Passivation behaviour was evident in all the solder formulations containing Al, compared to the base SAC solder. FESEM and XRD results revealed that more dense passive films were formed on the solder containing Al, compared to the base solder. These passivation films contained intermetallic compounds such as Al 2O 3, AlCuO 4, SnO and SnO 2 served to prevent further reaction on the material surface. Polarization studies showed that the corrosion rate was 30% and 6% lower for alloys with 0.5 wt% and 0.2 wt% Al content, respectively, even though the corrosion potential shifted towards more negative values. The Al-added solder alloys exhibit more refined surface after exposure in the salt spray chamber and revealed no visible infiltration of aggressive ions at the solder-substrate joint. This work suggests a corrosion mitigation strategy for SAC 105 solder through doping of Al.
UR - http://www.scopus.com/inward/record.url?scp=84948441342&partnerID=8YFLogxK
U2 - 10.1039/c5ra18453c
DO - 10.1039/c5ra18453c
M3 - Article
AN - SCOPUS:84948441342
VL - 5
SP - 99058
EP - 99064
JO - RSC Advances
JF - RSC Advances
SN - 2046-2069
IS - 120
ER -