Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 268-279 |
| Seitenumfang | 12 |
| Fachzeitschrift | tm - Technisches Messen |
| Jahrgang | 91 |
| Ausgabenummer | 5 |
| Frühes Online-Datum | 16 Apr. 2024 |
| Publikationsstatus | Veröffentlicht - 27 Mai 2024 |
| Extern publiziert | Ja |
Abstract
Dimensional and contact resonance (CR) images of nanowire (NW) arrays (NWAs) are measured using our newly developed microprobe CR imaging (CRI) setup. Then a reference method is employed to calculate the indentation modulus of NWs (M i,NW ) representing the elasticity of NWs, by measuring NWAs and reference samples at the same static probing force. Furthermore, topography is imaged in combination with CR and M i,NW separately by software, in which the z values indicate the topography of the NWs and the color bars show its CR or M i,NW . Then NWs' topography relation to M i,NW is visualized. As typical examples, 3D imaging of topography and measurement of M i,NW is performed with Si<111> pillar arrays as well as Cu and ZnO NWAs. The novel method enables fast mechanical performance measurements of large-scale vertically-aligned NWAs without releasing them from their respective substrates. For instance, the diameter and pitch of the Si<111> pillars and the diameter of the Cu NWAs are in good agreement with the values measured by scanning electron microscopy (SEM). The position of ZnO NWs bunches grown at arbitrary sites on silicon can be identified with the help of combined topography and indentation modulus images. Furthermore, M i,NW measured by our homemade CRI setup agrees well with bulk values. Differences between the measured M i,NW and bulk M i values may be related to a size effect in NW elasticity.
ASJC Scopus Sachgebiete
- Physik und Astronomie (insg.)
- Instrumentierung
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: tm - Technisches Messen, Jahrgang 91, Nr. 5, 27.05.2024, S. 268-279.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - Imaging the mechanical properties of nanowire arrays
AU - Ma, Tianran
AU - Fahrbach, Michael
AU - Xu, Jiushuai
AU - Anang, Frank eric boye
AU - Vergin, Maximilian
AU - Meierhofer, Florian
AU - Brand, Uwe
AU - Waag, Andreas
AU - Peiner, Erwin
N1 - Publisher Copyright: © 2024 Walter de Gruyter GmbH, Berlin/Boston.
PY - 2024/5/27
Y1 - 2024/5/27
N2 - Dimensional and contact resonance (CR) images of nanowire (NW) arrays (NWAs) are measured using our newly developed microprobe CR imaging (CRI) setup. Then a reference method is employed to calculate the indentation modulus of NWs (M i,NW ) representing the elasticity of NWs, by measuring NWAs and reference samples at the same static probing force. Furthermore, topography is imaged in combination with CR and M i,NW separately by software, in which the z values indicate the topography of the NWs and the color bars show its CR or M i,NW . Then NWs' topography relation to M i,NW is visualized. As typical examples, 3D imaging of topography and measurement of M i,NW is performed with Si<111> pillar arrays as well as Cu and ZnO NWAs. The novel method enables fast mechanical performance measurements of large-scale vertically-aligned NWAs without releasing them from their respective substrates. For instance, the diameter and pitch of the Si<111> pillars and the diameter of the Cu NWAs are in good agreement with the values measured by scanning electron microscopy (SEM). The position of ZnO NWs bunches grown at arbitrary sites on silicon can be identified with the help of combined topography and indentation modulus images. Furthermore, M i,NW measured by our homemade CRI setup agrees well with bulk values. Differences between the measured M i,NW and bulk M i values may be related to a size effect in NW elasticity.
AB - Dimensional and contact resonance (CR) images of nanowire (NW) arrays (NWAs) are measured using our newly developed microprobe CR imaging (CRI) setup. Then a reference method is employed to calculate the indentation modulus of NWs (M i,NW ) representing the elasticity of NWs, by measuring NWAs and reference samples at the same static probing force. Furthermore, topography is imaged in combination with CR and M i,NW separately by software, in which the z values indicate the topography of the NWs and the color bars show its CR or M i,NW . Then NWs' topography relation to M i,NW is visualized. As typical examples, 3D imaging of topography and measurement of M i,NW is performed with Si<111> pillar arrays as well as Cu and ZnO NWAs. The novel method enables fast mechanical performance measurements of large-scale vertically-aligned NWAs without releasing them from their respective substrates. For instance, the diameter and pitch of the Si<111> pillars and the diameter of the Cu NWAs are in good agreement with the values measured by scanning electron microscopy (SEM). The position of ZnO NWs bunches grown at arbitrary sites on silicon can be identified with the help of combined topography and indentation modulus images. Furthermore, M i,NW measured by our homemade CRI setup agrees well with bulk values. Differences between the measured M i,NW and bulk M i values may be related to a size effect in NW elasticity.
KW - 3D contact resonance imaging (CRI)
KW - indentation modulus of NWs (M )
KW - nanowire arrays (NWAs)
UR - http://www.scopus.com/inward/record.url?scp=85190719362&partnerID=8YFLogxK
U2 - 10.1515/teme-2023-0159
DO - 10.1515/teme-2023-0159
M3 - Article
VL - 91
SP - 268
EP - 279
JO - tm - Technisches Messen
JF - tm - Technisches Messen
SN - 0340-837X
IS - 5
ER -