Details
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 1311-1316 |
| Seitenumfang | 6 |
| Fachzeitschrift | Microelectronics reliability |
| Jahrgang | 44 |
| Ausgabenummer | 9-11 SPEC. ISS. |
| Publikationsstatus | Veröffentlicht - Sept. 2004 |
Abstract
Delaminations are a major concern in plastic encapsulated devices (PED). This paper presents three complementary methods to evaluate the sensitivity of PED to this problem. Analytical models are fast to implement, and permit to derive a comparative evaluation between different packages. To refine the results, finite element models, necessitating longer calculation times are very useful, but need to be validated by real measurements, which can be done with assembly test chips.
ASJC Scopus Sachgebiete
- Werkstoffwissenschaften (insg.)
- Elektronische, optische und magnetische Materialien
- Physik und Astronomie (insg.)
- Atom- und Molekularphysik sowie Optik
- Ingenieurwesen (insg.)
- Sicherheit, Risiko, Zuverlässigkeit und Qualität
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Werkstoffwissenschaften (insg.)
- Oberflächen, Beschichtungen und Folien
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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in: Microelectronics reliability, Jahrgang 44, Nr. 9-11 SPEC. ISS., 09.2004, S. 1311-1316.
Publikation: Beitrag in Fachzeitschrift › Artikel › Forschung › Peer-Review
}
TY - JOUR
T1 - How to study delamination in plastic encapsulated devices
AU - Frémont, Hélène
AU - Delétage, Jean Yves
AU - Weide-Zaage, Kirsten
AU - Danto, Yves
N1 - Copyright: Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2004/9
Y1 - 2004/9
N2 - Delaminations are a major concern in plastic encapsulated devices (PED). This paper presents three complementary methods to evaluate the sensitivity of PED to this problem. Analytical models are fast to implement, and permit to derive a comparative evaluation between different packages. To refine the results, finite element models, necessitating longer calculation times are very useful, but need to be validated by real measurements, which can be done with assembly test chips.
AB - Delaminations are a major concern in plastic encapsulated devices (PED). This paper presents three complementary methods to evaluate the sensitivity of PED to this problem. Analytical models are fast to implement, and permit to derive a comparative evaluation between different packages. To refine the results, finite element models, necessitating longer calculation times are very useful, but need to be validated by real measurements, which can be done with assembly test chips.
UR - http://www.scopus.com/inward/record.url?scp=4544281990&partnerID=8YFLogxK
U2 - 10.1016/j.microrel.2004.07.015
DO - 10.1016/j.microrel.2004.07.015
M3 - Article
AN - SCOPUS:4544281990
VL - 44
SP - 1311
EP - 1316
JO - Microelectronics reliability
JF - Microelectronics reliability
SN - 0026-2714
IS - 9-11 SPEC. ISS.
ER -