Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2015 IEEE International Symposium on Electromagnetic Compatibility, EMC 2015 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers Inc. |
| Seiten | 1323-1328 |
| Seitenumfang | 6 |
| ISBN (elektronisch) | 9781479966158 |
| Publikationsstatus | Veröffentlicht - 10 Sept. 2015 |
| Veranstaltung | IEEE International Symposium on Electromagnetic Compatibility, EMC 2015 - Dresden, Deutschland Dauer: 16 Aug. 2015 → 22 Aug. 2015 |
Publikationsreihe
| Name | IEEE International Symposium on Electromagnetic Compatibility |
|---|---|
| Band | 2015-Septmber |
| ISSN (Print) | 1077-4076 |
| ISSN (elektronisch) | 2158-1118 |
Abstract
The design process of integrated circuits is based on guidelines by the technological feasibility to achieve minimum structural size. Furthermore quality criteria like reliability and lifetime of the circuit influence the layout. The density of transistors increases and the supplied voltages as well as the noise margins also increase. In this frame the signal integrity as well as the electromagnetic behavior of IC interconnects, the traces in the printed circuit board, the connections of packages, have to be taken into account. Especially in 3-D integration and under harsh environment conditions the electromagnetic field has to be investigated.
ASJC Scopus Sachgebiete
- Physik und Astronomie (insg.)
- Physik der kondensierten Materie
- Ingenieurwesen (insg.)
- Elektrotechnik und Elektronik
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2015 IEEE International Symposium on Electromagnetic Compatibility, EMC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. S. 1323-1328 7256363 (IEEE International Symposium on Electromagnetic Compatibility; Band 2015-Septmber).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - How SI/EMC and reliability issues could interact together in embedded electronic systems?
AU - Weide-Zaage, Kirsten
AU - Moujbani, Aymen
AU - Duchamp, Genevieve
AU - Dubois, Tristan
AU - Verdier, Frederic
AU - Fremont, Helene
N1 - Publisher Copyright: © 2015 IEEE. Copyright: Copyright 2016 Elsevier B.V., All rights reserved.
PY - 2015/9/10
Y1 - 2015/9/10
N2 - The design process of integrated circuits is based on guidelines by the technological feasibility to achieve minimum structural size. Furthermore quality criteria like reliability and lifetime of the circuit influence the layout. The density of transistors increases and the supplied voltages as well as the noise margins also increase. In this frame the signal integrity as well as the electromagnetic behavior of IC interconnects, the traces in the printed circuit board, the connections of packages, have to be taken into account. Especially in 3-D integration and under harsh environment conditions the electromagnetic field has to be investigated.
AB - The design process of integrated circuits is based on guidelines by the technological feasibility to achieve minimum structural size. Furthermore quality criteria like reliability and lifetime of the circuit influence the layout. The density of transistors increases and the supplied voltages as well as the noise margins also increase. In this frame the signal integrity as well as the electromagnetic behavior of IC interconnects, the traces in the printed circuit board, the connections of packages, have to be taken into account. Especially in 3-D integration and under harsh environment conditions the electromagnetic field has to be investigated.
KW - electromigration
KW - reliability
KW - signal integrity
KW - simulation
UR - http://www.scopus.com/inward/record.url?scp=84953855688&partnerID=8YFLogxK
U2 - 10.1109/isemc.2015.7256363
DO - 10.1109/isemc.2015.7256363
M3 - Conference contribution
AN - SCOPUS:84953855688
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 1323
EP - 1328
BT - 2015 IEEE International Symposium on Electromagnetic Compatibility, EMC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE International Symposium on Electromagnetic Compatibility, EMC 2015
Y2 - 16 August 2015 through 22 August 2015
ER -