TY - JOUR

T1 - Guest Editorial Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface

T2 - Joint Design and Cointegration

AU - Hong, Wonbin

AU - Maaskant, Rob

AU - Liu, Duixian

AU - Wang, Hua

AU - Shamim, Atif

AU - Smolders, Bart

AU - Manteuffel, Dirk Michael

AU - Zhang, Yueping

N1 - Funding information: This Special Cluster would not have been possible without spectacular teamwork. The guest editors sincerely express their gratitude to Prof. C. Fumeaux, the Editor-in-Chief of the IEEE ANTENNAS AND PROPAGATION LETTERS, for his encouragement, consultation, and trust. In addition, we thank C. Sideri, the Editorial Assistant for her prompt support. In addition, the guest editors immensely thank all the authors who have contributed during the submission process for their enthusiasm and effort. Finally, yet importantly, we thank the reviewers for upholding the quality of this Special Cluster, which would not have been possible without their magnificent devotion.

PY - 2019/11

Y1 - 2019/11

N2 - The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.

AB - The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.

UR - http://www.scopus.com/inward/record.url?scp=85075023300&partnerID=8YFLogxK

U2 - 10.1109/lawp.2019.2945829

DO - 10.1109/lawp.2019.2945829

M3 - Editorial in journal

AN - SCOPUS:85075023300

VL - 18

SP - 2345

EP - 2350

JO - IEEE Antennas and Wireless Propagation Letters

JF - IEEE Antennas and Wireless Propagation Letters

SN - 1536-1225

IS - 11

M1 - 8891841

ER -