Formation of highly aluminum-doped p-type silicon regions by in-line high-rate evaporation

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OriginalspracheEnglisch
Seiten (von - bis)1720-1722
Seitenumfang3
FachzeitschriftSolar Energy Materials and Solar Cells
Jahrgang95
Ausgabenummer7
Frühes Online-Datum4 März 2011
PublikationsstatusVeröffentlicht - Juli 2011
Extern publiziertJa

Abstract

Highly aluminum-doped p-type silicon regions are formed by in-line high-rate evaporation of aluminum. We deposit aluminum layers of 28 μm thickness at dynamic deposition rates of 20 μm×m/min on p-type silicon substrates. Due to the high substrate temperature of up to 770 °C during deposition an Al-doped p region is formed. Using the camera-based dynamic infrared lifetime mapping technique we measure emitter saturation current densities of 695±65 fA/cm2 for the fully metalized Al-p regions, which corresponds to an implied solar cell open-circuit voltage of 635±2 mV.

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Formation of highly aluminum-doped p-type silicon regions by in-line high-rate evaporation. / Mader, Christoph; Bock, Robert; Schmidt, Jan et al.
in: Solar Energy Materials and Solar Cells, Jahrgang 95, Nr. 7, 07.2011, S. 1720-1722.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Mader C, Bock R, Schmidt J, Brendel R. Formation of highly aluminum-doped p-type silicon regions by in-line high-rate evaporation. Solar Energy Materials and Solar Cells. 2011 Jul;95(7):1720-1722. Epub 2011 Mär 4. doi: 10.1016/j.solmat.2011.01.039
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abstract = "Highly aluminum-doped p-type silicon regions are formed by in-line high-rate evaporation of aluminum. We deposit aluminum layers of 28 μm thickness at dynamic deposition rates of 20 μm×m/min on p-type silicon substrates. Due to the high substrate temperature of up to 770 °C during deposition an Al-doped p region is formed. Using the camera-based dynamic infrared lifetime mapping technique we measure emitter saturation current densities of 695±65 fA/cm2 for the fully metalized Al-p regions, which corresponds to an implied solar cell open-circuit voltage of 635±2 mV.",
keywords = "Alloying, Aluminum-doped silicon, Crystalline silicon solar cell, In-line evaporation",
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T1 - Formation of highly aluminum-doped p-type silicon regions by in-line high-rate evaporation

AU - Mader, Christoph

AU - Bock, Robert

AU - Schmidt, Jan

AU - Brendel, Rolf

N1 - Funding Information: This work is supported by the State of Lower Saxony.

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Y1 - 2011/7

N2 - Highly aluminum-doped p-type silicon regions are formed by in-line high-rate evaporation of aluminum. We deposit aluminum layers of 28 μm thickness at dynamic deposition rates of 20 μm×m/min on p-type silicon substrates. Due to the high substrate temperature of up to 770 °C during deposition an Al-doped p region is formed. Using the camera-based dynamic infrared lifetime mapping technique we measure emitter saturation current densities of 695±65 fA/cm2 for the fully metalized Al-p regions, which corresponds to an implied solar cell open-circuit voltage of 635±2 mV.

AB - Highly aluminum-doped p-type silicon regions are formed by in-line high-rate evaporation of aluminum. We deposit aluminum layers of 28 μm thickness at dynamic deposition rates of 20 μm×m/min on p-type silicon substrates. Due to the high substrate temperature of up to 770 °C during deposition an Al-doped p region is formed. Using the camera-based dynamic infrared lifetime mapping technique we measure emitter saturation current densities of 695±65 fA/cm2 for the fully metalized Al-p regions, which corresponds to an implied solar cell open-circuit voltage of 635±2 mV.

KW - Alloying

KW - Aluminum-doped silicon

KW - Crystalline silicon solar cell

KW - In-line evaporation

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JO - Solar Energy Materials and Solar Cells

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