Details
| Originalsprache | Englisch |
|---|---|
| Titel des Sammelwerks | 2007 1st Annual RFID Eurasia |
| Publikationsstatus | Veröffentlicht - 29 Okt. 2007 |
| Veranstaltung | 2007 1st Annual RFID Eurasia - Istanbul, Türkei Dauer: 5 Sept. 2007 → 6 Sept. 2007 |
Publikationsreihe
| Name | 2007 1st Annual RFID Eurasia |
|---|
Abstract
This paper describes the assembly of integrated circuits on flexible substrates in an industrial flip chip process allowing reel-to-reel production. Die bonding concepts to meet future demands for high-throughput solutions at low cost are introduced. Since the range of process parameters such as temperatures and bonding forces is closely linked to the properties of the substrates, an overview of different materials that can be used as flexible substrates is given. Material properties are compared and different processes for metallisation and structuring are described. Furthermore, the multi-stage tag production process is illustrated. Introducing straps, in order to decouple the pre-bonding and final bonding process steps, permits improvement of the achievable throughput and usage of very simple equipment for final assembly. Using these methods, a new type of UHF-ID tag based on thin polymer foil was produced. A unique antenna design matches different impedances and allows the tags to be mounted on different materials with little influence on their read range. Their tenuousness and flexibility allows to hide these tags, for example in cardboard packaging. Possible applications with focus on detecting plagiarism are discussed.
ASJC Scopus Sachgebiete
- Informatik (insg.)
- Computernetzwerke und -kommunikation
- Sozialwissenschaften (insg.)
- Kommunikation
Zitieren
- Standard
- Harvard
- Apa
- Vancouver
- BibTex
- RIS
2007 1st Annual RFID Eurasia. 2007. 4368094 (2007 1st Annual RFID Eurasia).
Publikation: Beitrag in Buch/Bericht/Sammelwerk/Konferenzband › Aufsatz in Konferenzband › Forschung › Peer-Review
}
TY - GEN
T1 - Flip chip assembly of UHF-ID electronics on flexible substrates
AU - Heiserich, Gerd
AU - Franke, Stefan
AU - Fahlbusch, Thomas
AU - Overmeyer, Ludger
AU - Altmann, Dirk
PY - 2007/10/29
Y1 - 2007/10/29
N2 - This paper describes the assembly of integrated circuits on flexible substrates in an industrial flip chip process allowing reel-to-reel production. Die bonding concepts to meet future demands for high-throughput solutions at low cost are introduced. Since the range of process parameters such as temperatures and bonding forces is closely linked to the properties of the substrates, an overview of different materials that can be used as flexible substrates is given. Material properties are compared and different processes for metallisation and structuring are described. Furthermore, the multi-stage tag production process is illustrated. Introducing straps, in order to decouple the pre-bonding and final bonding process steps, permits improvement of the achievable throughput and usage of very simple equipment for final assembly. Using these methods, a new type of UHF-ID tag based on thin polymer foil was produced. A unique antenna design matches different impedances and allows the tags to be mounted on different materials with little influence on their read range. Their tenuousness and flexibility allows to hide these tags, for example in cardboard packaging. Possible applications with focus on detecting plagiarism are discussed.
AB - This paper describes the assembly of integrated circuits on flexible substrates in an industrial flip chip process allowing reel-to-reel production. Die bonding concepts to meet future demands for high-throughput solutions at low cost are introduced. Since the range of process parameters such as temperatures and bonding forces is closely linked to the properties of the substrates, an overview of different materials that can be used as flexible substrates is given. Material properties are compared and different processes for metallisation and structuring are described. Furthermore, the multi-stage tag production process is illustrated. Introducing straps, in order to decouple the pre-bonding and final bonding process steps, permits improvement of the achievable throughput and usage of very simple equipment for final assembly. Using these methods, a new type of UHF-ID tag based on thin polymer foil was produced. A unique antenna design matches different impedances and allows the tags to be mounted on different materials with little influence on their read range. Their tenuousness and flexibility allows to hide these tags, for example in cardboard packaging. Possible applications with focus on detecting plagiarism are discussed.
UR - http://www.scopus.com/inward/record.url?scp=49949094814&partnerID=8YFLogxK
U2 - 10.1109/RFIDEURASIA.2007.4368094
DO - 10.1109/RFIDEURASIA.2007.4368094
M3 - Conference contribution
AN - SCOPUS:49949094814
SN - 9750156609
SN - 9789750156601
T3 - 2007 1st Annual RFID Eurasia
BT - 2007 1st Annual RFID Eurasia
T2 - 2007 1st Annual RFID Eurasia
Y2 - 5 September 2007 through 6 September 2007
ER -