Flaw Detection on a Tilted Particleboard by Use of the Spec-Radiation Method

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Autoren

  • Andreas Sebastian Schmelt
  • Jens Twiefel
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Details

OriginalspracheEnglisch
Aufsatznummer8513
Seiten (von - bis)1-18
Seitenumfang18
FachzeitschriftApplied Sciences (Switzerland)
Jahrgang10
Ausgabenummer23
PublikationsstatusVeröffentlicht - 28 Nov. 2020

Abstract

Herein, we present a novel approach to the spec-radiation method (a method of acoustical holography) for determining the sound distribution on a tilted particleboard by calculating a single plane and rotation in the frequency domain. The tilted particleboard allows testing without standing waves between the transmitter and the particleboard. This eliminates the need to evaluate several parallel planes and to search for values belonging to the tilted particleboard. The numerical requirements can be optimally exploited through a combination with a flaw detectability enhancement method. The results are supported by experiments on a wooden particleboard with flaw imitations. Finally, we showed, through a comparison with the usual procedure of identifying a flaw (calculating many parallel planes and then selecting the data belonging to the tilted plane), that the calculation of the tilted plane is up to 98.5% faster and improves the detectability of flaws in a tilted particleboard.

ASJC Scopus Sachgebiete

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Flaw Detection on a Tilted Particleboard by Use of the Spec-Radiation Method. / Schmelt, Andreas Sebastian; Twiefel, Jens.
in: Applied Sciences (Switzerland), Jahrgang 10, Nr. 23, 8513, 28.11.2020, S. 1-18.

Publikation: Beitrag in FachzeitschriftArtikelForschungPeer-Review

Schmelt AS, Twiefel J. Flaw Detection on a Tilted Particleboard by Use of the Spec-Radiation Method. Applied Sciences (Switzerland). 2020 Nov 28;10(23):1-18. 8513. doi: 10.3390/app10238513, 10.15488/11072
Schmelt, Andreas Sebastian ; Twiefel, Jens. / Flaw Detection on a Tilted Particleboard by Use of the Spec-Radiation Method. in: Applied Sciences (Switzerland). 2020 ; Jahrgang 10, Nr. 23. S. 1-18.
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